ABRADING DEVICE AND ABRADING METHOD EMPLOYING THE SAME

Title:

ABRADING DEVICE AND ABRADING METHOD EMPLOYING THE SAME

Document Type and Number:

WIPO Patent Application WO/1993/015878

Kind Code:

A1

Abstract:

A device for abrading a large-scale flat substrate such as a silicon wafer, a quartz substrate, a glass substrate, and a metallic substrate. A sample (B) is abraded and worked by means of an abrading surface plate (1) while it is fixed by means of a vacuum chuck (4) on a sample holding table (3) with an abrasive (8) being supplied from an abrasive supplying nozzle (7). An elastic body (201) is secured to the underside of the abrading surface plate (1), and an abrasive cloth (2) is then secured to the underside of the elastic body. Since a hard type of abrasive cloth (2) is used, micro recessed and raised portions of the sample (B) can be worked to become smooth, and the elastic body (201) acts to realize uniform working.

Inventors:

BEPPU TOSHIYASU (JP)
WATANABB JUNJI (JP)

Application Number:

PCT/JP1993/000173

Publication Date:

August 19, 1993

Filing Date:

February 12, 1993

Export Citation:

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Assignee:

SUMITOMO METAL IND (JP)

International Classes:

B24B41/06; (IPC1-7): B24B37/00; B24B37/04

Foreign References:

JPS5590263A	1980-07-08
JPS63200966A	1988-08-19

Other References: