Title:
ABRASIVE COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
Document Type and Number:
WIPO Patent Application WO/2010/024404
Kind Code:
A1
Abstract:
An abrasive composition which is used during the pattern formation wherein buried copper wiring and insulating layers are alternately formed by grinding each copper layer formed on each insulating layer via a barrier layer, specifically in a process wherein each copper layer is ground until the barrier layer adjacent thereto is exposed. The abrasive composition contains a dodecylbenzenesulfonic acid component, and at least one planarity-improving agent selected from the group consisting of an alkenyl succinic acid component, a polyoxyethylene alkyl ether carboxylic acid component and a polyoxyethylene alkyl ether phosphoric acid component.
More Like This:
| JP09296200 | COMPOSITION OF HYDROXYLAMINE-GALL COMPOUND AND ITS USE |
| JP11040490 | SUBSTRATE ROTATION TYPE TREATING APPARATUS |
| WO/2005/091687 | MICRO PLASMA JET GENERATOR |
Inventors:
YOSHIDA Iori (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
吉田 伊織 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
吉田 伊織 (〒05 東京都千代田区有楽町一丁目１２番１号 旭硝子株式会社内 Tokyo, 〒1008405, JP)
Application Number:
JP2009/065103
Publication Date:
March 04, 2010
Filing Date:
August 28, 2009
Export Citation:
Assignee:
Asahi Glass Company, Limited. (12-1, Yurakucho 1-chome Chiyoda-k, Tokyo 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区有楽町一丁目１２番１号 Tokyo, 〒1008405, JP)
YOSHIDA Iori (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
旭硝子株式会社 (〒05 東京都千代田区有楽町一丁目１２番１号 Tokyo, 〒1008405, JP)
YOSHIDA Iori (Limited. 12-1, Yurakucho 1-chome, Chiyoda-k, Tokyo 05, 〒1008405, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
OGURI Shohei et al. (Eikoh Patent Firm, 7-13 Nishi-Shimbashi 1-chome, Minato-k, Tokyo 03, 〒1050003, JP)
Download PDF: