Title:
ABRASIVE COMPOSITION FOR POLISHING LSI DEVICE
Document Type and Number:
WIPO Patent Application WO/2000/008678
Kind Code:
A1
Abstract:
An abrasive composition for polishing a LSI device comprising water and cerium oxide particles which have been surface-treated with a coupling agent, wherein the cerium oxide particles have a secondary particle size distribution such that a maximum value is 5 $g(m)m or less and a mean value is 0.01 to 1.0 $g(m)m. A method for polishing a LSI device using this abrasive composition.
Inventors:
KIDOU TAKANORI (JP)
TSUJINO NORIO (JP)
ICHIKAWA KAGETAKA (JP)
UOTANI NOBUO (JP)
TSUJINO NORIO (JP)
ICHIKAWA KAGETAKA (JP)
UOTANI NOBUO (JP)
Application Number:
PCT/JP1999/004241
Publication Date:
February 17, 2000
Filing Date:
August 05, 1999
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
KIDOU TAKANORI (JP)
TSUJINO NORIO (JP)
ICHIKAWA KAGETAKA (JP)
UOTANI NOBUO (JP)
KIDOU TAKANORI (JP)
TSUJINO NORIO (JP)
ICHIKAWA KAGETAKA (JP)
UOTANI NOBUO (JP)
International Classes:
C09G1/02; H01L21/304; C09K3/14; H01L21/306; (IPC1-7): H01L21/304
Domestic Patent References:
| WO1997011484A1 | 1997-03-27 | |||
| WO1998049723A1 | 1998-11-05 |
Foreign References:
| JPH08134435A | 1996-05-28 | |||
| JPH10152673A | 1998-06-09 | |||
| JPS60127965A | 1985-07-08 |
Other References:
See also references of EP 1130630A4
Attorney, Agent or Firm:
Ishida, Takashi (Ishida & Associates Toranomon 37 Mori
Building, 5-1, Toranomon 3-chom, Minato-ku Tokyo, JP)
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