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Title:
ABRASIVE GRAINS, MANUFACTURING METHOD THEREFOR, POLISHING SLURRY CONTAINING SAID ABRASIVE GRAINS, AND POLISHING METHOD USING SAID POLISHING SLURRY
Document Type and Number:
WIPO Patent Application WO/2018/020931
Kind Code:
A1
Abstract:
Abrasive grains according to the present invention are abrasive grains in which the surfaces thereof are coated with an additive and that are formed of inorganic abrasive particles having a positive zeta potential at pH 8 or lower. Also, it is preferable that the additive be picolinic acid or glutamic acid. It is preferable that the inorganic abrasive particles be cerium oxide particles. The present invention provides abrasive grains in which the surfaces thereof are coated with picolinic acid or glutamic acid and that are formed of cerium oxide particles having a positive zeta potential at pH 8 or lower, wherein the abrasive grains are manufactured by means of an abrasive grain manufacturing method including a step for performing wet grinding of cerium oxide in the presence of picolinic acid or glutamic acid.

Inventors:
HOSOI, Daisuke (6-17-13 Higashinarashino, Narashino-sh, Chiba 01, 〒2750001, JP)
MACHIDA, Shingo (6-17-13 Higashinarashino, Narashino-sh, Chiba 01, 〒2750001, JP)
SHIGETA, Takashi (6-17-13 Higashinarashino, Narashino-sh, Chiba 01, 〒2750001, JP)
Application Number:
JP2017/023456
Publication Date:
February 01, 2018
Filing Date:
June 26, 2017
Export Citation:
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Assignee:
BAIKOWSKI JAPAN CO., LTD. (6-17-13 Higashinarashino, Narashino-shi Chiba, 01, 〒2750001, JP)
International Classes:
C09K3/14; B24B37/00; C09G1/02; H01L21/304
Attorney, Agent or Firm:
SHOWA INTERNATIONAL PATENT FIRM (NIKKEN AKASAKA BLDG, 7F. 5-7, Akasaka 2-chome, Minato-K, Tokyo 52, 〒1070052, JP)
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