Title:
ABRASIVE GRAINS, ABRASIVE SLURRY AND METHOD FOR POLISHING HARD, BRITTLE MATERIALS, AND METHOD FOR PRODUCING HARD, BRITTLE MATERIALS
Document Type and Number:
WIPO Patent Application WO/2016/204248
Kind Code:
A1
Abstract:
Provided are abrasive grains and an abrasive slurry that make it possible to achieve both higher polishing speed and surface smoothness on hard, brittle materials such as sapphires. Abrasive grains to be used to polish hard, brittle materials, the abrasive grains characterized by containing connected particles having one or more necks and being an inorganic oxide powder having an average particle size of 3 μm or less.
Inventors:
KAJINO TEPPEI (JP)
OZAKI HIROTAKA (JP)
SAITOU YUZURU (JP)
OZAKI HIROTAKA (JP)
SAITOU YUZURU (JP)
Application Number:
PCT/JP2016/067994
Publication Date:
December 22, 2016
Filing Date:
June 16, 2016
Export Citation:
Assignee:
SUMITOMO CHEMICAL CO (JP)
International Classes:
C09K3/14; B24B1/00; B24B37/00; B24D3/00; H01L21/304
Domestic Patent References:
| WO2013153618A1 | 2013-10-17 | |||
| WO2011136387A1 | 2011-11-03 | |||
| WO2012115020A1 | 2012-08-30 |
Foreign References:
| JP2005001985A | 2005-01-06 | |||
| JP2007055888A | 2007-03-08 | |||
| JP2010515656A | 2010-05-13 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
Mutsumi Sameshima (JP)
Mutsumi Sameshima (JP)
Download PDF: