Title:
ABRASIVE MATERIAL COMPOSITION AND METHOD FOR POLISHING MAGNETIC DISK SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2017/051770
Kind Code:
A1
Abstract:
Provided is an abrasive material composition with which it is possible to not only achieve a high polishing rate without requiring the use of alumina particles but also obtain satisfactory surface smoothness and edge surface shape. The abrasive material composition comprises colloidal silica, pulverized wet-process silica particles, and a water-soluble high-molecular-weight compound, wherein the water-soluble high-molecular-weight compound is a copolymer having a constituent unit derived from an unsaturated aliphatic carboxylic acid and a constituent unit derived from an unsaturated amide.
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Inventors:
IWATA TORU (JP)
SUGAWA AKIRA (JP)
SUGAWA AKIRA (JP)
Application Number:
PCT/JP2016/077369
Publication Date:
March 30, 2017
Filing Date:
September 16, 2016
Export Citation:
Assignee:
YAMAGUCHI SEIKEN KOGYO CO LTD (JP)
International Classes:
C09K3/14; C09G1/02; G11B5/84
Domestic Patent References:
| WO2015146941A1 | 2015-10-01 | |||
| WO2015146942A1 | 2015-10-01 |
Foreign References:
| JP2015125792A | 2015-07-06 | |||
| JP2008179763A | 2008-08-07 | |||
| JP2001207161A | 2001-07-31 | |||
| JP2005008875A | 2005-01-13 | |||
| JP2004331852A | 2004-11-25 |
Attorney, Agent or Firm:
WATANABE, Kazuhira (JP)
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