ABRASIVE MATERIAL

Title:

ABRASIVE MATERIAL

Document Type and Number:

WIPO Patent Application WO/2001/091975

Kind Code:

A1

Abstract:

An abrasive material which is especially excellent in the dispersion of abrasive grains even when the grains are contained in a large amount, and which has stable polishing properties and is effective in diminishing scratches. The abrasive material comprises a polishing part which can be obtained by introducing given amounts of butadiene, styrene, methyl methacrylate, itaconic acid, acrylic acid, $g(a)-methylstyrene dimer, and t-dodecyl mercaptan into an autoclave, reacting them at 75°C for 16 hours to obtain an emulsion of a copolymer, adjusting the pH of this emulsion to 8.5, adding thereto a cerium oxide powder having an average primary-particle diameter of 0.3 $g(m)m, stirring the resultant mixture to obtain an aqueous dispersion, thinly spreading this aqueous dispersion on a film, drying it, and then pressing the resultant dry mixture with a mold press. The polishing part may have a crosslinked structure. The abrasive material is suitable for use as, e.g., a polishing pad for polishing the surface of, e.g., a semiconductor wafer.

Inventors:

HASEGAWA KOU (JP)
SATOU HOZUMI (JP)
ISHIKAWA OSAMU (JP)
HOSAKA YUKIO (JP)

Application Number:

PCT/JP2001/004483

Publication Date:

December 06, 2001

Filing Date:

May 29, 2001

Export Citation:

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Assignee:

JSR CORP (JP)
HASEGAWA KOU (JP)
SATO HOZUMI (JP)
ISHIKAWA OSAMU (JP)
HOSAKA YUKIO (JP)

International Classes:

B24B37/24; B24D3/28; B24D11/00; B24D18/00; C09K3/14; (IPC1-7): B24D3/20; B24D3/00

Foreign References:

JPH02626965A
JPH106231A	1998-01-13
JPH06254769A	1994-09-13
JPH03281172A	1991-12-11
JPH11198045A	1999-07-27
JP2000301461A	2000-10-31

Other References: