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Title:
ABRASIVE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2011/070839
Kind Code:
A1
Abstract:
An abrasive material is provided with which it is possible to polish silicon carbide, which is difficult to polish, with a high degree of surface precision. The abrasive material is characterized by comprising manganese dioxide particles in which particles examined with a scanning electron microscope have a nonacicular shape having a ratio of the major-axis to the minor-axis diameter of 3.0 or less. The examined particles preferably have an average major-axis diameter DSEM of 1.0 µm or smaller. The abrasive material preferably has a 50% volume-cumulative diameter D50, as determined through particle diameter distribution analysis by the laser diffraction/scattering method, of 2.0 µm or smaller.

Inventors:
HORIUCHI, Mikimasa (LTD. Engineered Materials Sector Rare Metals Division 1-11-1, Osaki, Shinagawa-k, Tokyo 84, 〒1418584, JP)
堀内 幹正 (〒84 東京都品川区大崎一丁目11番1号三井金属鉱業株式会社 機能材料事業本部 レアメタル事業部内 Tokyo, 〒1418584, JP)
KURODA, Ryutaro (LTD. Engineered Materials Sector Rare Metals Division 1-11-1, Osaki, Shinagawa-k, Tokyo 84, 〒1418584, JP)
Application Number:
JP2010/067080
Publication Date:
June 16, 2011
Filing Date:
September 30, 2010
Export Citation:
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Assignee:
MITSUI MINING & SMELTING CO.,LTD. (1-11-1, Osaki Shinagawa-k, Tokyo 84, 〒1418584, JP)
三井金属鉱業株式会社 (〒84 東京都品川区大崎一丁目11番1号 Tokyo, 〒1418584, JP)
HORIUCHI, Mikimasa (LTD. Engineered Materials Sector Rare Metals Division 1-11-1, Osaki, Shinagawa-k, Tokyo 84, 〒1418584, JP)
堀内 幹正 (〒84 東京都品川区大崎一丁目11番1号三井金属鉱業株式会社 機能材料事業本部 レアメタル事業部内 Tokyo, 〒1418584, JP)
International Classes:
B24B37/04; C09K3/14
Attorney, Agent or Firm:
TANAKA AND OKAZAKI (Hongo K&K Bldg, 30-10 Hongo 3-chome, Bunkyo-k, Tokyo 33, 〒1130033, JP)
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