Title:
ABRASIVE FOR MOISTURE BLASTING, AND MANUFACTURING METHOD FOR SAME
Document Type and Number:
WIPO Patent Application WO/2011/114556
Kind Code:
A1
Abstract:
Disclosed is an abrasive for use in moisture blasting. The disclosed abrasive is formed from spherical polymer particles derived from a monomer mixture containing 0.1-20 parts by weight of a (meth)acrylate monomer containing either an ether group and a hydroxyl group, or an ester group and a hydroxyl group, and 100 parts by weight of a vinyl monomer other than the (meth)acrylate monomer. When polymerisation to the surface of the spherical polymer particles takes place, the attached number of emulsions and/or microparticles which are secondarily generated is not greater than 9 (here the number of attached substances is the average value for five visual fields of an arbitrary region of 6μm x 5μm of the polymer particles).
Inventors:
ISHIMORI, Fumitaka (1259, Minakuchicho Izumi, Koka-sh, Shiga 51, 〒5291551, JP)
Application Number:
JP2010/066726
Publication Date:
September 22, 2011
Filing Date:
September 27, 2010
Export Citation:
Assignee:
SEKISUI PLASTICS CO.,LTD. (4-4 Nishitenma 2-chome, Kita-ku Osaka-sh, Osaka 47, 〒5300047, JP)
積水化成品工業株式会社 (〒47 大阪府大阪市北区西天満二丁目４番４号 Osaka, 〒5300047, JP)
積水化成品工業株式会社 (〒47 大阪府大阪市北区西天満二丁目４番４号 Osaka, 〒5300047, JP)
International Classes:
B24C11/00; C08F6/24; C08F220/00
Attorney, Agent or Firm:
NOGAWA, Shintaro (Nogawa Patent Office, Nishitenma Five Bldg. 16-3, Nishitenma 5-chome, Kita-ku, Osaka-sh, Osaka 47, 〒5300047, JP)
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Claims: