Title:
ABRASIVE PAD FOR CMP
Document Type and Number:
WIPO Patent Application WO2002014018
Kind Code:
A3
Abstract:
An abrasive pad for CMP has a substrate (12) and an abrasive layer disposed on the substrate. An abrasive pad for CMP having a substrate and an abrasive layer disposed on the substrate, wherein said abrasive layer has a three-dimensional structure including a plurality of regularly arranged three-dimensional elements (II) having a predetermined shape, and said abrasive layer comprises an abrasive composite containing advanced alumina abrasive grains produced by a CVD method and a binder as construction components.
Inventors:
AMANO TAKASHI (JP)
WATASE TOSHIHIKO (JP)
IMAMURA KENGO (JP)
WATASE TOSHIHIKO (JP)
IMAMURA KENGO (JP)
Application Number:
PCT/US2001/025006
Publication Date:
May 23, 2002
Filing Date:
August 09, 2001
Export Citation:
Assignee:
3M INNOVATIVE PROPERTIES CO (US)
AMANO TAKASHI (JP)
WATASE TOSHIHIKO (JP)
IMAMURA KENGO (JP)
AMANO TAKASHI (JP)
WATASE TOSHIHIKO (JP)
IMAMURA KENGO (JP)
International Classes:
B24B37/20; B24B37/22; B24B37/24; B24D3/00; B24D3/28; B24D13/14; C08J5/14; C08K7/00; C08L101/00; C09K3/14; H01L21/304; (IPC1-7): B24D11/00; B24B37/04; B24D13/14
Domestic Patent References:
| WO1997011484A1 | 1997-03-27 | |||
| WO1993024680A1 | 1993-12-09 |
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