Abrasive powder, oil and water dispensing system for diamond faceting process

4. DESCRIPTION

FIELD OF THE INVENTION

This invention relates to an abrasive powder, water and oil dispensing system for diamond faceting process. This invention particularly relates to a system for dispensing of abrasive powder and, water and oil mixture on polishing die for pavilion and crown processing and, table processing of diamond faceting process. An abrasive powder, water and oil dispensing system for diamond faceting process can be programmed for dispensing of abrasive powder and, water and oil mixture and can be operated using automatic means.

The abrasive powder, water and oil dispensing system for diamond faceting process as disclosed in the present invention can be used for crown and pavilion, and table processing of natural, mined, lab grown, synthetic, Chemical Vapor Deposition (CVD) and high pressure and high temperature (HPHT), single crystal diamond and Poly Crystalline Diamond (PCD) at controlled temperatures and in efficient way.

Using the system and the method disclosed in the present invention, diamond can be polished in any directions. Hence, polishing machine construction becomes simpler as movement of the diamond holder about an axis normal to the working plane for changing the grain orientation is not required. Further, using the system disclosed in the present invention, polishing of the diamond can be performed at controlled temperature which increases accuracy of polishing and doesn’t deteriorate optical quality of diamond.

The apparatus and the method disclosed in the present invention can be used for polishing of gem quality diamond for jewelry as well as for polishing of rough synthetic diamond films or natural diamond to get the finished components/ device for industrial use such as semiconductors, optical windows, heat spreaders, cutting tool bit etc.

BACKGROUND OF THE INVENTION

1

SUBSTITUTE SHEET (RULE 26) Diamond polishing is known and practiced since 16 A.D. i.e. from time period when diamonds were found and extracted from ground. Polishing of diamond for jewelry needs was known since 1352 when diamond jewels were polished for first time in French royal inventories and remained a trade secret for centuries. Hardness of diamond powder or another diamond stone is used for polishing of diamond in accordance with the principle “diamond cuts diamond”.

Use of natural diamond is limited in engineering applications because of inherent variability and scarcity observed in it. With the introduction and development of Chemical Vaporized Deposition (CVD) technique for production of synthetic diamond film, it has become possible to manufacture variety of components/ devices for industrial use such as semiconductors, optical windows, heat spreaders etc. However, diamond films grown by CVD technique are very rough and demand high degree of polishing to get the finished components/ device for industrial use.

Various diamond polishing techniques used in practice includes mechanical polishing, chemical-mechanical polishing, thermo-mechanical polishing, thermochemical polishing, dynamic friction polishing, polishing using high energy beam of laser/plasma/ionized gas and Electrical Discharge Machining (EDM). Use of the polishing techniques developed for gems are proved to be inefficient in polishing of synthetic diamond/ diamond films with extremely low polishing rate. Also synthetic diamond films are having very high hardness with low body strength and hence are likely to damaged and rapture while polishing.

Most commonly used method for polishing of diamond is mechanical polishing. Mechanical polishing of diamond is usually carried out using a cast iron wheel called a scaife with porous surface, charged with diamond powder and rotating at high speed. The diamond powder is mixed with olive oil, or some other base, to form a paste or suspension which is rubbed over the porous metal scaife and then left for some time for the suspension to be absorbed by the pores. The surface to be polished is held against the rotating scaife surface charge with diamond powder by applying a contact pressure. The final surface finish is controlled by the size of the abrasive powder used. In order to avoid recharging of the scaife with diamond powder, diamond-bonded scaife is used. The { 111 } plane of diamond is harder (up to 45 %) and more wear resistant than the others. By choosing a direction of easy abrasion and avoiding other directions (i.e. by confining the direction of the wear fracture plane), low damage and low surface roughness can be achieved for polishing of single crystal diamond. In Poly Crystalline Diamond (PCD), the individual grains of diamond are randomly oriented, so there will always be many grains which present themselves in orientations which are difficult to polish. Lapping processes with diamond grit slurry is used for rough processing of diamond. In diamond processing by lapping, the physical wear mechanism is brittle fracture resulting into rough surface with significant sub-surface damage.

Two main material removal mechanisms observed in mechanical polishing of diamond includes phase transformation of the diamond to sp ² bonded carbon and micro-fracture. Reported research shows that other wear mechanisms associated with diamond polishing in industry includes thermal, chemical and electrical wear. In mechanical abrasive polishing, when amorphous silicon oxide (SiOx) is coated on a rotating scaife, the SiOx (x=1.97) reacts with the diamond (and its carbon) to form CO and CO2 thereby removing carbon from the surface chemically in addition to the carbon being removed mechanically. Scratch-free polished diamond is successfully obtained in practice by rubbing a surface of the diamond to be polished against a smooth complementary diamond surface with sufficient pressure and velocity to heat the surface being polished above the spontaneous thermal degradation temperature of the diamond. There is a possibility of excessive thermal degradation of the diamond in this process and process needs intermittent cooling of diamond.

DESCRIPTION OF THE RELATED ART

The Patent No. GB 1421332 discloses an apparatus for polishing gemstones comprising polishing head, polishing surface, support means for polishing head, lifting and lowering means for support means. The Patent No. US4517770 discloses a gemstone polishing machine for working facets on a gemstone or the like, each facet having a grain orientation, using a moving working member which contacts the stone in a working plane.

Prior art discloses an apparatus and process for polishing of diamond in which step for manually detecting the direction of easy abrasion is omitted. The Patent No. US 8591288B2 describe mechanical processing of surface of diamond by providing unbound diamond grains between mechanical part and the surface of the diamond whereby processing is almost independent from the orientation of the processing direction in relation to the orientation of the crystal. The Patent No. CN104551974B discloses a diamond grinding and polishing method in which a plurality of diamond particles is rotated around the vertical line of the grinding and polishing surface of the grinding disc, so that the grinding disc can be ground in each crystal direction of the diamond particles. The Patent Application No. 1633/DELNP/2004 discloses a method and system for automatic diamond polishing. The Patent Application No. JP2010058204A discloses a lapping apparatus capable of lapping the single crystal diamond with high polishing efficiency by automatically adjusting the single crystal diamond grain direction in accordance with the lapping direction without requiring a skilled worker. The Patent No. US4287687 discloses a variable work holding device capable of searching the grain automatically for optimum cutting and intended to be used with ordinary scaife for the grinding of various gemstones and industrial diamonds. The Patent No. GB2168276A and GB2212423A disclose a device for cutting facets of diamond by automatically locating ideal position of diamond after determining the direction with lowest hardness. The Patent No. GB2249742A discloses a polishing member for working a facet of a small gemstone of weight less than 10 pts. The Patent No. GB2249743A present a method of working a multi-grain facet of a gemstone using a polishing member which engages the facet and effectively moves in one direction past the stone as a whole, comprising rotating the stone continuously about an axis at right angles to the surface of the polishing member until substantially whole of the facet has been formed. The Patent Publication No. WO03/053632A2 provides a stand-alone gem stone polishing system and method, for automatic diamond polishing by calculating the optimum grain position. Considerable amount of heat is generated in mechanical polishing of diamond using various methods. Excessive heat generation results into temperature degradation of the diamond. The Patent Application No. CN102343546A discloses a method for carrying out high-speed lapping on a sintered poly crystalline diamond cooled by a cold plate, and the method is characterized in that the non-lapping surface of the sintered polycrystalline diamond is clamped on a copper cold plate with a high-efficiency cooling function. The Patent Application No. CN1092909 and CN109333332 disclose a diamond clamping apparatus with a cooling device. The Patent No. CN202240893 discloses water cooling polishing fixture for poly crystalline diamond. The Patent No. CN207997223 discloses a device for precision polishing of single crystal diamond, which improves the polishing of single crystal diamond by improving the single crystal diamond clamping method and the thermal conductivity of the curing adhesive. The Patent No. CN208438159 discloses a processing device for poly crystalline diamond mirror polishing having a heat dissipating structure on both the clamping mechanism and a polishing mechanism. The Patent No. GB2257069A discloses a gemstone holding apparatus with cooling means. The Patent No. JP2019038103 discloses a diamond polishing apparatus and a diamond polishing method capable of reducing wear of a polishing tool and increasing polishing efficiency in order to extend life of the polishing tool. The Patent No. US4484418 discloses a process for polishing of gemstones which comprises establishing a layer of abrasive embedded in a suitable solid matrix in or on the surface of a rotary plate and polishing gemstones, overheating being prevented by high enthalpy of solid/liquid transition of said matrix.

OBJECT OF THE INVENTION

The principal object of this invention is to present a system for dispensing of abrasive powder and, water and oil mixture during pavilion and crown processing and, table processing in diamond faceting process.

Another object of the present invention is to provide a system that controls the flow of abrasive powder and, water and oil mixture on polishing surface during pavilion and crown processing and, table processing and thereby increases the efficiency of polishing.

Another object of this invention is to present a system and method that controls the temperature of abrasive powder and, water and oil mixture and thereby controls the temperature of diamond while pavilion and crown processing and, table processing.

Another object of this invention is to present a system and method that can be programmed for automatic dispensing of abrasive powder and, water and oil mixture as well can be operated manually for dispensing of abrasive powder and, water and oil mixture.

Another object of the present invention is to provide a system that can charge abrasive powder and, water and oil mixture with additional fresh abrasive powder when efficiency of polishing drops during the pavilion and crown processing and, table processing in diamond faceting process.

Yet another object of present invention is to provide a system that prevents deterioration of optical properties while polishing of gem quality diamond for jewelry or CVD diamond film for industrial applications.

Traditionally, mechanical polishing of diamond is performed by pressing the surface to be polished against a rotating cast iron wheel (called a scaife) of carefully selected porosity, charged with diamond powder. The diamond powder is mixed with olive oil, or some other base, to form a paste or suspension which is rubbed over the metal scaife and then left for some time for the suspension to be absorbed by the pores. Mechanical polishing is commonly used for polishing single crystal diamond, which may be polished fairly readily by choosing a direction of easy abrasion and avoiding other directions. But the individual grains of diamond in PCD are randomly oriented, so there will always be many grains which present themselves in orientations which are difficult to polish. In order to avoid having to recharge the wheels with diamond grit, diamond-bonded scaifes are used. These scaifes are more expensive than cast-iron scaifes. However, they avoid the interruptions and skilled labour required to keep cast-iron scaifes charged with abrasive powder. Traditional mechanical polishing methods for polishing of diamond is time consuming and needs skilled labour as direction of easy abrasion needs to be identified manually by trial- and-error method. Further, in the process of grain free cutting/ polishing of diamond disclosed in prior art, where unbound diamond grains are provided between mechanical part and the surface of the diamond, loose diamond grains get displaced by contact pressure maintained at interface of mechanical part and diamond surface and quickly rolled out of the interface resulting into poor efficiency and excessive wear of the mechanical part. In mechanical processing of diamonds, due to excessive heat generation at diamond and mechanical part contact interface, temperature of diamond rises quickly to the value in the range of few hundred °C. This increase in temperature of diamond increases the polishing rate of the diamond but it deteriorates the optical property of diamond. Further, heating of the glue used to stick the diamond to the diamond holder and heating of diamond holder loosens the diamond and adversely affect geometrical accuracy and surface finish of the polished diamond. In prior art, various techniques are disclosed to quickly dissipate the heat from the contact interface to limit the temperature of the diamond holder. Prior art also discloses the method in which the mechanical part is immersed partially or fully into the water containing loose diamond grains for polishing of diamond surface by using loose diamond grains contained in the water. As the density of the diamond is almost 3.5 times greater than that of water, diamond grains contained in water gets settled down at the bottom of the container and will not be available at the diamond and mechanical part interface for polishing resulting into poor polishing efficiency. Through rotation of the mechanical part is incapable of providing necessary turbulence to water containing diamond grains that is necessary for maintaining uniform concentration of the diamond grains in water though mechanical part is partially or fully immersed into it. Fluid containing diamond grains gets heated over the period of time because of heat dissipation from diamond mechanical part interface and rotating mechanical part.

SUMMARY OF THE INVENTION The present invention aims at providing a system for dispensing of abrasive powder and, water and oil mixture on polishing die for pavilion and crown processing and, table processing of diamond faceting process at controlled temperature that substantially obviates one or more problems due to limitations or disadvantages of the related prior art.

The abrasive powder, water and oil dispensing system for diamond faceting process as disclosed in the present invention can be used for efficient polishing of pavilion and crown and, table of both natural as well as synthetic (i.e. lab grown), single crystal diamond and Poly Crystalline Diamond (PCD) at controlled temperatures. Apparatus disclosed in the present patent application can be used while polishing of gem quality diamond as well as thin CVD diamond film for various industrial applications without deteriorating optical quality.

The abrasive powder, water and oil dispensing system for diamond faceting process is comprising of a main chamber; a water and oil dispenser in fluid communication with the main chamber for dispensing of water and oil mixture in main chamber; a powder dispenser attached to the main chamber for dispensing abrasive powder into the main chamber; a drainage system for draining of used abrasive powder and, water and oil mixture and cleaning of the main chamber before adding new water and oil mixture and abrasive powder; a cooling system in fluid communication with a chiller and in direct contact with abrasive powder, water and oil mixture in the main chamber for maintaining its temperature in a range of 25 - 30 °C; a temperature sensor inserted in the main chamber for measuring temperature of the abrasive powder and, water and oil mixture in the main chamber and, for operating the cooling system; a camera for calibrating and inspecting a diamond attached to a polishing die before starting polishing and during polishing process, a die cleaning device for cleaning of the diamond attached to the polishing die at intermediate stage during polishing and after its polishing for the purpose of inspection using the camera; a rotating lid provided with a pavilion and crown process wall, a table process wall and a sensor strip and mounted above the main chamber in such a way that provides rotational degree of freedom to the rotating lid in reference to the main chamber; a pavilion and crown process sensor bracket along with a sensor attached to it mounted on the main table for aligning of the pavilion and crown process wall with a working area slot of the main chamber by operating the motorized system; a table process sensor bracket along with a sensor attached to it mounted on the main table for aligning of the table process wall with a working area slot of the main chamber by operating the motorized system; a chamber cleaning process sensor bracket along with a sensor attached to it mounted on the main table for complete closing of the main chamber by operating the motorized system and for operating the drainage system for cleaning of the main chamber; a flow managing device mounted on the main chamber for controlling and directing flow of powder, water and oil mixture on a polishing surface; an acrylic wall fitted on the main table and around the main chamber to prevent the flow of abrasive, water and oil mixture to surface area of the main table.

Volume and timing of water and oil mixture dispense to the main chamber as well as draining of abrasive powder and, water and oil mixture from the main chamber can be programmed as per the requirement and controlled using automatic means. Volume and timing of water and oil mixture dispense to the main chamber as well as draining of abrasive powder and, water and oil mixture from the main chamber can also be controlled manually. Quantity and timing of abrasive powder dispense to the main chamber is controlled manually by judging an efficiency of polishing. This water level in the water and oil dispenser is maintained automatically using a water level sensor. The abrasive powder used is of material diamond, ceramic, silicon carbide, sapphire, boron nitride, gallium nitride, aluminum nitride etc. or any combination thereof.

While pavilion and crown processing, polishing collet along with polishing die needs to be set an angle with vertical. Hence pavilion and crown process wall shall be of such dimension that allows for entry of polishing collet set at an angle with vertical into the main chamber. While table processing, polishing collet along with polishing die needs to be set in vertical position. Use of the pavilion and crown process wall which is of greater dimension during table processing will result into more splashing of the abrasive powder and, water and oil mixture during polishing. In order to overcome this problem, the separate table processing wall is provided which is of smaller dimension preventing splashing of abrasive powder and, water and oil mixture during table processing. An acrylic wall is fitted on the main table and around the main chamber to prevent the flow of abrasive, water and oil mixture to surface area of the main table.

Volume and timing of water and oil mixture dispense to the main chamber can be programmed as per the requirement and controlled using automatic means. In another embodiment of the present invention, volume and timing of water and oil mixture dispense to the main chamber can be controlled manually. Timing for draining of the main chamber can be programmed as per the requirement and controlled using automatic means. In another embodiment of the present invention, the main chamber can be drained manually as per the requirement.

BRIEF DESCRIPTION OF THE DRAWINGS

The features of the invention as per the present patent application are described with reference to the following drawings in which like elements are labeled similarly. The present invention will be more clearly understood from the detailed description and the accompanying drawings, wherein:

FIG. 1 is a schematic diagram showing an exploded view of an abrasive powder, oil and water dispensing system for diamond faceting process.

FIG. 2 is a schematic diagram of positioning of the polishing die and collet during the pavilion and crown process.

FIG. 3 is a schematic diagram of positioning of the polishing die and collet during the table process.

FIG. 4 is a schematic diagram of positioning during the cleaning process.

FIG. 5 is a schematic diagram of positioning during the abrasive powder adding process.

List of designations/ reference numbers in figure

1. a water and oil dispenser

2. a powder dispenser 3. a water and oil pipe

4. a powder pipe

5. a cleaning inlet pipe

6. a driving pulley

7. a motorized system

8. a driven pulley

9. a bearing unit

10. a bearing

11. a shaft

12. a Camera

13. a table process wall

14. a polishing collet

15. a polishing die

16. a rotating lid

17. a pavilion and crown process wall

18. a sensor strip

19. an abrasive powder inlet hole

20. a main chamber

21. a working area slot

22. a temperature sensor hole

23. a temperature sensor

24. a flow managing device

25. a die cleaning device

26. a fix disc

27. a polishing surface

28. a cooling system cap

29. an oil seal

30. a cooling system

31. a chamber cleaning process sensor bracket

32. a table process sensor bracket

33. a pavilion and crown process sensor bracket

34. an acrylic wall 35. a drainage hole

36. a stainless steel protective sheet

37. a main table

38. a die cleaning system drainage valve

39. a die cleaning system drainage pipe

40. a drainage system

41. an inlet valve for cooling system

42. an outlet valve for cooling system

43. an inlet pipe for cooling system

44. an outlet pipe for cooling system

45. a main chamber drainage pipe

46. a level sensor

47. a water pump

48. a water source

49. a timing belt

DETAILED DESCRIPTION OF THE INVENTION

The following description of the preferred embodiment(s) is merely exemplary in nature and is in no way intended to limit the invention, its application, or uses.

The description of illustrative embodiments according to principles of the present invention is intended to be read in connection with the accompanying drawings, which are to be considered as a part of the entire written description. In the description of embodiments of the invention disclosed herein, any reference to direction or orientation is merely intended for convenience of description and is not intended in any way to limit the scope of the present invention. Relative terms and directives thereof are for convenience of description only and do not require that the apparatus be constructed or operated in a particular manner unless explicitly indicated as such. Terms such as “attached,” “affixed,” “connected,” “coupled,” “interconnected,” and similar refer to a relationship wherein structures are secured or attached to one another either directly or indirectly through intervening structures, as well as both movable or rigid attachments or relationships, unless expressly described otherwise. Moreover, the features and benefits of the invention are illustrated by reference to the exemplified embodiments. Accordingly, the invention expressly should not be limited to such exemplary embodiments illustrating some possible non-limiting combination of features that may exist alone or in other combinations of features; the scope of the invention being defined by the claims appended hereto.

FIG. 1 shows an exploded view of the abrasive powder, oil and water dispensing system for diamond faceting process.

As shown in FIG. 1, a main chamber (20) is mounted on a main table (37). A water and oil dispenser (1) in fluid communication with the main chamber (20) via. a water and oil pipe (3) for dispensing water and oil into the main chamber (20) during diamond faceting process as per the requirement. The water and oil dispenser (1) is connected to a water source (48) via. a water pump (47) for filling of water in it. A level sensor (46) is installed in the water and oil dispenser (1) for detecting the water level. This water level sensor (46) is electrically connected to the water pump (47) for automatically maintaining level of water in the water and oil dispenser (1). Some minimum and maximum threshold level is set in the level sensor (46). When water level in the water and oil dispenser (1) drops to the minimum threshold level, the level sensor (46) operates the water pump (47) to supply water from the water source (48) to the water and oil dispenser (1). On filling of water up to the maximum threshold level in the water and oil dispenser (1), the level sensor (46) cut off the water supply to the water and oil dispenser (1) from the water source (48). A calculated amount of water-soluble oil is mixed with water in the water and oil dispenser (1). Volume and timing of water and oil mixture dispense to the main chamber (20) is controlled using automatic means.

As shown in FIG. 1, a powder dispenser (2) is attached to the main chamber (20) via. a powder pipe (4) for dispensing abrasive powder into the main chamber (20) through an abrasive powder inlet hole (19). Quantity and timing of abrasive powder dispense to the main chamber (20) is controlled manually by judging an efficiency of polishing. As shown in FIG. 5, abrasive powder is added into the main chamber (20) by rotating the rotating hd (16) in a position that aligns the table process wall (13) with the abrasive powder inlet hole (19). The abrasive powder used is of material diamond, ceramic, silicon carbide, sapphire, boron nitride, gallium nitride, aluminum nitride etc. or any combination thereof.

As shown in FIG. 1, a drainage system (40) is used for draining of used abrasive powder, water and oil mixture from the main chamber (20) and cleaning of the main chamber (20) before adding new water and oil mixture and abrasive powder. The drainage system (40) is in fluid communication with the main chamber (20) through a drainage hole (35) for draining of used abrasive powder, water and oil mixture from the main chamber (20) via main chamber drainage pipe (45).

As shown in FIG. 1, a cooling system (30) is fastened to the main table (37). The cooling system (30) is in fluid communication with a chiller. The cooling system (30) is in direct contact with abrasive powder, water and oil mixture in the main chamber (20). The cooling system is made up of a metal having higher thermal conductivity preferably Aluminium. A coolant from the chiller is circulated through an inlet pipe (43), an inlet valve (41), the cooling system (30), an outlet valve (42) and an outlet pipe (44) for cooling of abrasive powder, water and oil mixture in the main chamber (20). A temperature sensor (23) is inserted into the main chamber (40) through a temperature sensor hole (22). The temperature sensor (23) is in electrical communication with the cooling system (30) for operating the cooling system (30) by measuring a temperature of abrasive powder, water and oil mixture in the main chamber (20). A temperature of abrasive powder, water and oil mixture in the main chamber (20) is maintained in a range of 25 - 30 °C using the cooling system (30).

As shown in FIG. 1, a camera (12) is mounted on the main table (37) for calibrating and inspecting a diamond attached to a polishing die (15) before starting polishing and during polishing process. A die cleaning device (25) is mounted on the main table (37) for cleaning of the diamond attached to the polishing die (15) at intermediate stage during polishing and after its polishing for the purpose of inspection using the camera (12). The die cleaning device (25) receives water and oil mixture for cleaning of the diamond from the water and oil dispenser (1) through a die cleaning inlet pipe (5) and excess water and oil mixture from the die cleaning device (25) after cleaning the diamond is drained through a drainage valve (38) and a drainage pipe (39).

As shown in FIG. 1, a rotating lid (16) is mounted above the main chamber (20) in such a way that provides rotational degree of freedom to the rotating lid (16) in reference to the main chamber (20). For the purpose, a fix disc (26) is concentrically fastened to the main chamber (20), a shaft (11) is concentrically fastened to the fix disc (26), a bearing (10) is fitted on the shaft (11) using interference fit, a bearing unit (9) is fastened to the bearing (10) and a rotating lid (16) fastened to the bearing unit (9) which in turn provides the rotational degree of freedom to the rotating lid (16) in reference to the main chamber (20).

As shown in FIG. 1, the rotating lid (16) is provided with pavilion and crown process wall (17), a table process wall (13) and a sensor strip (18) mounted on it. For pavilion and crown processing, the pavilion and crown process wall (17) of the rotating lid (16) needs to be aligned with a working area slot (21) of the main chamber (20). For table processing, the table process wall (13) mounted on the rotating lid (16) needs to be aligned with the working area slot (21) the working area slot (21) of the main chamber (20). For rotating the rotating lid (16) in a required position, a motorized system (7) is mounted on the main table (37). A driving pully (6) mounted on the motorized system (7) rotates a driven pully (8) fastened to the bearing unit (9) and this in turn rotates the rotating lid (16).

A pavilion and crown process sensor bracket (33) along with a sensor attached to it is mounted on the main table (37). A table process sensor bracket (32) along with a sensor attached to it is mounted on the main table (37). The sensor attached to the pavilion and crown process sensor bracket (33) and the sensor attached to the table process sensor bracket (32) are in electrical communication with the motorized system (7). As shown in FIG. 2, when a sensor strip (18) mounted on the rotating lid (16) senses the sensor attached to the pavilion and crown process sensor bracket (33), the sensor attached to the pavilion and crown process sensor bracket (33) operates the motorized system to align the pavilion and crown process wall (17) with the working area slot (21). As shown in FIG. 3, when a sensor strip (18) mounted on the rotating lid (16) senses the sensor attached to the table process sensor bracket (32), the sensor attached to the table process sensor bracket (32) operates the motorized system to align the table process wall (13) with the working area slot (21).

While pavilion and crown processing, polishing collet (14) along with polishing die (15) needs to be set an angle with vertical. Hence pavilion and crown process wall (17) shall be of such dimension that allows for entry of polishing collet set at an angle with vertical into the main chamber (20). While table processing, polishing collet (14) along with polishing die (15) needs to be set in vertical position. Use of the pavilion and crown process wall (17) which of greater dimension during table processing will result into more splashing of the abrasive powder and, water and oil mixture during polishing. In order to overcome this problem, the separate table processing wall (13) is provided which is of smaller dimension preventing splashing of abrasive powder and, water and oil mixture during table processing.

As shown in FIG. 1, a chamber cleaning process sensor bracket (31) along with a sensor attached to it is mounted on the main table (37). The sensor attached to the chamber cleaning process sensor bracket (31) is in electrical communication with the drainage system (40). As shown in FIG. 4, when the sensor strip (18) mounted on the rotating lid (16) senses the sensor attached to the chamber cleaning process sensor bracket (31), the sensor attached to the chamber cleaning process sensor bracket (31) operates the drainage system (40) for draining abrasive powder, water and oil mixture from the main chamber (20) for cleaning of the main chamber (20) and charging fresh mixture of abrasive powder, water and oil.

As shown in FIG. 1, a flow managing device (24) is mounted on the main chamber (20) for controlling flow of powder, water and oil mixture on a polishing surface (27). As shown in FIG. 1, an acrylic wall (34) is fitted on the main table (37) and around the main chamber (20) to prevent the flow of abrasive, water and oil mixture to surface area of the main table (37). The flow managing device (24) continuously replaces abrasive powder and, water and oil mixture displaced by contact pressure exerted at interface of mechanical part and diamond surface during polishing resulting improved efficiency of polishing.

Volume and timing of water and oil mixture dispense to the main chamber (20) can be programmed as per the requirement and controlled using automatic means. In another embodiment of the present invention, volume and timing of water and oil mixture dispense to the main chamber (20) can be controlled manually.

Timing for draining of the main chamber (20) can be programmed as per the requirement and controlled using automatic means. In another embodiment of the present invention, the main chamber (20) can be drained manually as per the requirement.