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Title:
ABRASIVE RECOVERY METHOD AND ABRASIVE RECOVERY DEVICE
Document Type and Number:
WIPO Patent Application WO/2012/114395
Kind Code:
A1
Abstract:
Provided are an abrasive recovery method and abrasive recovery device capable of recovering a slurry comprising a highly-concentrated abrasive while avoiding increases in pressure loss and large decreases in the recovery rate due to membrane blocking. A device (1) for recovering an abrasive from a used polishing slurry which has been used in a CMP process has a separation membrane (41) with a cylindrical hole passage into which the used polishing slurry is introduced. The hole passage of the separation membrane (41) is no more than 0.8m in length in an effective filtration unit. The abrasive recovery device (1) concentrates the abrasive of the used polishing slurry to a concentration of 10 mass% or greater.

Inventors:
ISHII KEIICHIRO (JP)
HIOKI SHOJI (JP)
Application Number:
PCT/JP2011/004593
Publication Date:
August 30, 2012
Filing Date:
August 16, 2011
Export Citation:
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Assignee:
NOMURA MICRO SCIENCE KK (JP)
ISHII KEIICHIRO (JP)
HIOKI SHOJI (JP)
International Classes:
B01D61/14; H01L21/304; B01D61/58; B01D63/02; B01D63/06; B01D71/16; B01D71/26; B01D71/34; B01D71/36; B01D71/64; B01D71/68; B24B37/00; B24B57/00; C02F1/44
Foreign References:
JP2002075929A2002-03-15
JP2008000750A2008-01-10
JPH11121408A1999-04-30
JP2002016027A2002-01-18
JP2001077066A2001-03-23
Other References:
"Asahikasei UF Module Microza SLP-2053 Toriatsukai Setsumeisho", TORIATSUKAI SETSUMEISHO, 22 October 2008 (2008-10-22), pages 20, 25
"Microza UF Labmodule Toriatsukai Setsumeisho", TORIATSUKAI SETSUMEISHO, 7 August 2008 (2008-08-07), pages 4 - 5
Attorney, Agent or Firm:
SAKURA PATENT OFFICE, p. c. (JP)
Patent business corporation cherry tree international patent firm (JP)
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Claims: