Title:
ABRASIVE SLURRY, ABRASIVE SET, AND METHOD FOR GRINDING SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2010/143579
Kind Code:
A1
Abstract:
Provided is an abrasive slurry comprising water, abrasive grains, and one or more additives, wherein the abrasive grains comprise particles of the hydroxide of a tetravalent metal and at least one of the additives is polyvinyl alcohol having a degree of saponification of 95 mol% or lower. Also provided are: an abrasive set that comprises portions of the abrasive slurry, one of which is a slurry containing particles and the other of which is an additive liquid containing an additive, the portions being separately stored; and a method for grinding a substrate, wherein a film to be ground is ground using the abrasive slurry. With the abrasive slurry, the abrasive set, and the substrate-grinding method, it is possible to rapidly grind an insulating film, e.g., a silicon oxide film, while minimizing scratches, in the CMP technique for making STI dielectric films, pre-metal dielectric films, interlayer dielectrics, etc. planar. The abrasive slurry has a high insulating film/polysilicon film grinding rate ratio.
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Inventors:
RYUZAKI, Daisuke (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
龍崎 大介 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
HOSHI, Yousuke (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
星 陽介 (〒47 茨城県つくば市和台４８ 日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
龍崎 大介 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
HOSHI, Yousuke (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
星 陽介 (〒47 茨城県つくば市和台４８ 日立化成工業株式会社内 Ibaraki, 〒3004247, JP)
Application Number:
JP2010/059436
Publication Date:
December 16, 2010
Filing Date:
June 03, 2010
Export Citation:
Assignee:
HITACHI CHEMICAL COMPANY, LTD. (1-1 Nishishinjuku 2-chome, Shinjuku-ku Tokyo, 49, 〒1630449, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
RYUZAKI, Daisuke (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
龍崎 大介 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
HOSHI, Yousuke (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
日立化成工業株式会社 (〒49 東京都新宿区西新宿二丁目１番１号 Tokyo, 〒1630449, JP)
RYUZAKI, Daisuke (13-1, Higashi-cho 4-chome, Hitachi-sh, Ibaraki 55, 〒3178555, JP)
龍崎 大介 (〒55 茨城県日立市東町四丁目１３番１号 日立化成工業株式会社内 Ibaraki, 〒3178555, JP)
HOSHI, Yousuke (48, Wadai, Tsukuba-sh, Ibaraki 47, 〒3004247, JP)
International Classes:
H01L21/304; B24B37/00; C09K3/14
Attorney, Agent or Firm:
MIYOSHI, Hidekazu et al. (Toranomon Kotohira Tower, 2-8 Toranomon 1-chome, Minato-k, Tokyo 01, 〒1050001, JP)
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