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Title:
ABSORBENT ARTICLE MANUFACTURING METHOD AND ADHESIVE AGENT APPLICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/208500
Kind Code:
A1
Abstract:
The present invention allows reduction in, for example, a time period required for switching a hot-melt adhesive agent, and inhibits impurities from being mixed in the hot-melt adhesive agent, at the time of manufacturing of multiple types of absorbent articles in a single manufacturing line. With this absorbent article manufacturing method, multiple types of absorbent articles are manufactured in a single manufacturing line including an application device. An application device (70) is provided with: a first supply portion (71-1) which supplies a first hot-melt adhesive agent; a second supply portion (71-2) which supplies a second hot-melt adhesive agent; a switching portion (76) which selects either one of the first and second supply portions; and an application portion (82) which applies the first or second hot-melt adhesive agent to a material. The manufacturing method comprises: a step in which the switching portion selects the first supply portion, and the application portion applies the first hot-melt adhesive agent to a first material, at the time of manufacturing of a first absorbent article; and a step in which the switching portion selects the second supply portion, and the application portion applies the second hot-melt adhesive agent to a second material, at the time of manufacturing of a second absorbent article.

Inventors:
SUZUKI, Yuichi (1531-7 Wadahama, Toyohama-cho, Kanonji-sh, Kagawa 02, 〒7691602, JP)
SAKAUE, Haruhiko (1531-7 Wadahama, Toyohama-cho, Kanonji-sh, Kagawa 02, 〒7691602, JP)
Application Number:
JP2017/004079
Publication Date:
December 07, 2017
Filing Date:
February 03, 2017
Export Citation:
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Assignee:
UNICHARM CORPORATION (182 Shimobun, Kinsei-cho Shikokuchuo-sh, Ehime 11, 〒7990111, JP)
International Classes:
A61F13/15; B05C5/02; B05C11/10
Foreign References:
JP2013215580A2013-10-24
JPH06206023A1994-07-26
Attorney, Agent or Firm:
AOKI, Atsushi et al. (SEIWA PATENT & LAW, Toranomon 37 Mori Bldg. 5-1, Toranomon 3-chome, Minato-k, Tokyo 23, 〒1058423, JP)
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