Title:
ACCELERATING THE BREAKUP OF FLUID BRIDGES FOR MICRO-DISPENSING APPLICATIONS
Document Type and Number:
WIPO Patent Application WO/2018/027678
Kind Code:
A1
Abstract:
Conductive viscoelastic adhesives are often used to bond silicon dies and printed circuit boards (PCB) together. The deposit of these adhesives on substrates through nozzles may lead to liquid bridges whose breakup causes stringing and the generation of satellite droplets resulting in the contamination of the adjacent droplets. Also the time to break up the bridges may be excessive. In order to overcome these problems the nozzle is rotated and the aspect ratio of the bridges is kept small.
Inventors:
SHUM HO CHEUNG (CN)
CHAN SAN TO (CN)
FAIZI HAMMAD ALI (CN)
CHAN SAN TO (CN)
FAIZI HAMMAD ALI (CN)
Application Number:
PCT/CN2016/094405
Publication Date:
February 15, 2018
Filing Date:
August 10, 2016
Export Citation:
Assignee:
UNIV HONG KONG (CN)
International Classes:
B05C9/00; B05B1/00
Foreign References:
| JP2000042467A | 2000-02-15 | |||
| US20140010730A1 | 2014-01-09 | |||
| JP2004259742A | 2004-09-16 | |||
| US20040113970A1 | 2004-06-17 | |||
| US6720263B2 | 2004-04-13 |
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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