Title:
ACCELERATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2010/150476
Kind Code:
A1
Abstract:
Provided is an acceleration sensor, which has, in the vicinity of electrode pads, an improved reliability using a wafer-level package. The acceleration sensor (100) has: a sensor section (110) composed of Al wiring (116) which connects an acceleration detecting element with the electrode pads (115a-115d) formed on a frame (111); a protection film (117) laminated on the Al wiring (116) formed on the frame (111) and the part of each of the electrode pads (115a-115d); a cap section (118) which covers the sensor section (110) and houses the sensor section (110) in a hermetically sealed space; and a bonding layer (119) which is laminated on the protection film (117) and bonds together the sensor section (110) and the cap section (118).
Inventors:
HASEKO YOSHIHIRO
SUGANO TAKAYUKI
SUGANO TAKAYUKI
Application Number:
PCT/JP2010/003911
Publication Date:
December 29, 2010
Filing Date:
June 11, 2010
Export Citation:
Assignee:
MITSUMI ELECTRIC CO LTD (JP)
HASEKO YOSHIHIRO
SUGANO TAKAYUKI
HASEKO YOSHIHIRO
SUGANO TAKAYUKI
International Classes:
G01P15/12; G01P15/08; G01P15/18; H01L29/84
Foreign References:
| JP2001305152A | 2001-10-31 | |||
| JP2009122113A | 2009-06-04 |
Attorney, Agent or Firm:
WASHIDA, KIMIHITO (JP)
Koichi Washida (JP)
Koichi Washida (JP)
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