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Title:
ACID COPPER ELECTROPLATING PROCESS USING INSOLUBLE ANODE AND EQUIPMENT THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/103621
Kind Code:
A1
Abstract:
An acid copper electroplating process using an insoluble anode and equipment therefor. In the process and the equipment, a separator (10) is used to separate electroplating solutions in a cathode region (1) and an anode region (2), to avoid the phenomenon of reverse etching of a plated part at the cathode by the electroplating solution in the cathode region (1), bringing high current efficiency and preferable electroplating quality, and meeting quality requirements for acid copper plating. A regeneration tank (4) is additionally provided for formulating a regenerative electroplating solution, in which copper metal, which is less expensive than copper oxide and phosphor copper can be used. The use of oxygen as an oxidizing agent to realize the energy-saving and environmentally-friendly process for formulating copper sulfate through regeneration by recycling the cathode electroplating solution achieves better economic effects than the prior art using copper oxide and phosphor copper, and can also prevent oxygen added during the regeneration from reverse etching a plating layer and impacting the quality of copper plating.

Inventors:
YE YITING (CN)
Application Number:
PCT/CN2017/114562
Publication Date:
June 14, 2018
Filing Date:
December 05, 2017
Export Citation:
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Assignee:
YE YITING (CN)
International Classes:
C25D3/00; C25D5/00; C25D17/00; C25D21/18
Foreign References:
CN101532160A2009-09-16
CN102644095A2012-08-22
CN101407935B2011-09-07
CN103917691B2016-02-10
US6054037A2000-04-25
US3634205A1972-01-11
Attorney, Agent or Firm:
GUANGZHOU ZHIYOU PATENT & TRADEMARK AGENCY CO., LTD. (CN)
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