Title:
ACID GROUP-CONTAINING (METH)ACRYLATE RESIN COMPOSITION, CURABLE RESIN COMPOSITION, CURED PRODUCT AND RESIN MATERIAL FOR SOLDER RESISTS
Document Type and Number:
WIPO Patent Application WO/2019/244868
Kind Code:
A1
Abstract:
The present invention provides: an acid group-containing (meth)acrylate resin composition which contains an acid group-containing (meth)acrylate resin (A) and an amine-modified epoxy resin (B), and which is characterized in that the content of the amine-modified epoxy resin (B) is from 0.5 part by mass to 40 parts by mass (inclusive) in terms of solid content relative to 100 parts by mass of the solid content of the acid group-containing (meth)acrylate resin (A); a curable resin composition which contains this acid group-containing (meth)acrylate resin composition; a cured product; an insulating material which is composed of the above-described photosensitive resin composition; a resin material for solder resists; and a resist member. This acid group-containing (meth)acrylate resin composition has excellent adhesion to a base material, high optical sensitivity and excellent alkali developability at the same time, and is able to form a cured product that exhibits excellent elongation.
Inventors:
YAMADA SHUNSUKE (JP)
KAMEYAMA HIROFUMI (JP)
NAKAMURA YUMIKO (JP)
KAMEYAMA HIROFUMI (JP)
NAKAMURA YUMIKO (JP)
Application Number:
PCT/JP2019/024034
Publication Date:
December 26, 2019
Filing Date:
June 18, 2019
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08L63/10; C08G18/67; C08G59/14; C08G59/40; C08L75/14; C08L101/02; G03F7/027; G03F7/032; H05K3/28
Foreign References:
| JPH04252276A | 1992-09-08 | |||
| JP2006503944A | 2006-02-02 | |||
| JP2009186564A | 2009-08-20 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
Download PDF:
Previous Patent: LENS SYSTEM AND IMAGING DEVICE
Next Patent: BONDED STRUCTURE OF CIRCUIT MEMBERS AND METHOD FOR BONDING CIRCUIT MEMBERS
Next Patent: BONDED STRUCTURE OF CIRCUIT MEMBERS AND METHOD FOR BONDING CIRCUIT MEMBERS