Title:
ACID GROUP-CONTAINING (METH)ACRYLATE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST, AND RESIST MEMBER
Document Type and Number:
WIPO Patent Application WO/2020/179287
Kind Code:
A1
Abstract:
The present invention provides: an acid group-containing (meth)acrylate resin characterized by containing a reaction product (I) of an epoxy resin (A), an unsaturated monobasic acid (B), and a polybasic acid anhydride (C), an epoxy resin (D), and an unsaturated monobasic acid (E) as essential reaction raw materials; a curable resin composition containing the acid group-containing (meth)acrylate resin; a cured product comprising the curable resin composition; an insulating material; a resin material for a solder resist; and a resist member. The acid group-containing (meth)acrylate resin has excellent photosensitivity and alkali developability and makes it possible to form a cured product having excellent elongation.
Inventors:
YAMADA SHUNSUKE (JP)
KAMEYAMA HIROFUMI (JP)
KAMEYAMA HIROFUMI (JP)
Application Number:
PCT/JP2020/002901
Publication Date:
September 10, 2020
Filing Date:
January 28, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08G59/17; C08F290/14; G03F7/027; H01B3/44; H05K3/28
Foreign References:
| JPH0987346A | 1997-03-31 | |||
| JP2004131526A | 2004-04-30 | |||
| JP2007003590A | 2007-01-11 | |||
| JP2000267275A | 2000-09-29 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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