Title:
ACID GROUP-CONTAINING (METH)ACRYLATE RESIN, CURABLE RESIN COMPOSITION, INSULATING MATERIAL, RESIN MATERIAL FOR SOLDER RESIST, AND RESIST MEMBER
Document Type and Number:
WIPO Patent Application WO/2021/220922
Kind Code:
A1
Abstract:
The present invention provides an acid group-containing (meth)acrylate resin characterized by being obtained from, as essential materials: a (meth)acrylic copolymer (A) obtained from, as essential materials, a methacrylate compound (a1) having an aromatic ring and a compound (a2) other than said compound (a1) and having a reactive functional group and a polymerizable unsaturated group; a compound (B) other than said compound (a1) and said compound (a2), having a polymerizable unsaturated group, and having a functional group that can react with a reactive functional group derived from said compound (a2) included in the copolymer (A); and a polybasic acid anhydride (C). The acid group-containing (meth)acrylate resin has high photosensitivity and excellent alkaline developability and can form a cured product having excellent heat resistance, thermal yellowing resistance, and reflectivity.
Inventors:
YAMADA SHUNSUKE (JP)
Application Number:
PCT/JP2021/016236
Publication Date:
November 04, 2021
Filing Date:
April 22, 2021
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F8/14; C08F290/12; G03F7/038
Foreign References:
| JP2016149388A | 2016-08-18 | |||
| JP2013210405A | 2013-10-10 | |||
| JP2013182174A | 2013-09-12 | |||
| JP2012198527A | 2012-10-18 | |||
| JP2012215833A | 2012-11-08 | |||
| JP2013033207A | 2013-02-14 | |||
| JP2013137373A | 2013-07-11 | |||
| JP2013076833A | 2013-04-25 | |||
| JP2014130417A | 2014-07-10 | |||
| JP2014210892A | 2014-11-13 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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