Title:
ACID SULFATE ELECTROPLATING COPPER COMBINATION ADDITIVE FOR DENSE FILLING OF PCB THROUGH HOLE METAL
Document Type and Number:
WIPO Patent Application WO/2023/246889
Kind Code:
A1
Abstract:
Disclosed in the present invention is an acid sulfate electroplating copper combination additive for dense filling of PCB through hole metal. The additive is made up of a bridger, a carrier, a refiner, and a leveler having mass ratios of 10-100:50-1500:0.1-20:0.1-100. In the present invention, an inorganic substance for supplying halogen anions is used as the bridger, a polyol, a polyether, or a polyester compound is used as the carrier, a sulfur-containing compound is used as the refiner, and a primary/secondary/tertiary amine or quaternary ammonium salt is used as the leveler, which, in combination with specific high-copper low-acid, temperature, plating solution stirring, air blowing, cathode moving, and electroplating current density conditions, achieve dense filling of PCB through holes.
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Inventors:
ZHAN DONGPING (CN)
JIN LEI (CN)
WANG ZHAOYUN (CN)
YANG JIAQIANG (CN)
ZHENG ANNI (CN)
YANG FANGZU (CN)
TIAN ZHONGQUN (CN)
JIN LEI (CN)
WANG ZHAOYUN (CN)
YANG JIAQIANG (CN)
ZHENG ANNI (CN)
YANG FANGZU (CN)
TIAN ZHONGQUN (CN)
Application Number:
PCT/CN2023/101793
Publication Date:
December 28, 2023
Filing Date:
June 21, 2023
Export Citation:
Assignee:
UNIV XIAMEN (CN)
International Classes:
C25D3/38; C25D21/14
Foreign References:
| CN115142100A | 2022-10-04 | |||
| CN113337857A | 2021-09-03 | |||
| JP2013053336A | 2013-03-21 | |||
| CN112941575A | 2021-06-11 |
Attorney, Agent or Firm:
SHOUCHUANG JUNHE PATENT AGENT CO., LTD.XIAMEN (CN)
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