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Patent Searching and Data


Title:
ACIDIC COPPER PLATING SOLUTION, ACIDIC COPPER PLATED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/090161
Kind Code:
A1
Abstract:
This acidic copper plating solution comprises a first additive made of a quaternary ammonium salt polymer, at least one type of second additive selected from the group consisting of 2-mercapto-5-benzimidazole sulfonic acid, ethylene thiourea, and a partial 2-mercapto-5-benzimidazole sulfonate salt of poly(diallyldimethylammonium chloride), and a third additive made of bis-(sulfopropyl)disulfide, the acidic copper plating solution having a copper concentration of from 10 to 60 g/L, having a sulfuric acid concentration of from 10 to 200 g/L, including less than or equal to 100 mg/L chloride ions, and being capable of producing an acidic copper plated product having low thermal expansivity.

Inventors:
KONDO, Kazuo (1-344-1, Okumotocho Kita-ku, Sakai-sh, Osaka 07, 〒5918007, JP)
Application Number:
JP2015/083280
Publication Date:
June 01, 2017
Filing Date:
November 26, 2015
Export Citation:
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Assignee:
KONDO, Kazuo (1-344-1, Okumotocho Kita-ku, Sakai-sh, Osaka 07, 〒5918007, JP)
International Classes:
C25D3/38; C25D7/00; C25D7/12; H05K3/18; H05K3/40; H05K3/42
Foreign References:
JP2001274116A2001-10-05
JP2006265632A2006-10-05
JP2009242940A2009-10-22
JP2008533224A2008-08-21
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (AOYAMA & PARTNERS, Umeda Hankyu Bldg. Office Tower 8-1, Kakuda-cho, Kita-ku, Osaka-sh, Osaka 17, 〒5300017, JP)
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