Title:
ACIDIC COPPER PLATING SOLUTION, ACIDIC COPPER PLATED PRODUCT, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/090563
Kind Code:
A1
Abstract:
This acidic copper plating solution comprises a first additive made of a cationic polymer, at least one type of second additive selected from the group consisting of 2-mercapto-5-benzimidazole sulfonic acid, sodium 2-mercapto-5-benzimidazole sulfonate dihydrate, ethylene thiourea, and a partial 2-mercapto-5-benzimidazole sulfonate salt of poly(diallyldimethylammonium chloride), and a third additive made of a sulfur atom-containing organic compound, the acidic copper plating solution having a copper concentration of from 10 to 60 g/L, having a sulfuric acid concentration of from 10 to 200 g/L, including less than or equal to 90 mg/L chloride ions, and being capable of producing an acidic copper plated product having low thermal expansivity.
Inventors:
KONDO KAZUO (JP)
Application Number:
PCT/JP2016/084499
Publication Date:
June 01, 2017
Filing Date:
November 21, 2016
Export Citation:
Assignee:
KONDO KAZUO (JP)
International Classes:
C25D3/38; C25D7/00; C25D7/12; H05K3/18; H05K3/42
Foreign References:
| JP2010242151A | 2010-10-28 | |||
| JP2010265532A | 2010-11-25 | |||
| JP2010535289A | 2010-11-18 | |||
| JP2009242940A | 2009-10-22 | |||
| JP2006265632A | 2006-10-05 | |||
| JP2008533224A | 2008-08-21 |
Attorney, Agent or Firm:
SAMEJIMA, Mutsumi et al. (JP)
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