INVENTOR: GARY PAIK

BACKGROUND OF THE INVENTION:

Flooring assemblies comprising flooring elements configured to be joined together to form finished floors having acoustic, sound-attenuating properties meeting or surpassing building sound code requirements (STC and IIC ratings) are highly desirous in the building industry. These codes require a high degree of suppression of sound transmissions between floors of buildings. Conventionally employed flooring elements may comprise multi-layer composite laminates having acoustic, sound- attenuating properties adapted for attachment thereof to subfioor substrates.

The most common forms of attachment to subfloors of floor assemblies constructed of conventional flooring elements are mechanical in nature; i.e.. nails, staples, bolts, screws, and the like. The penetration of the acoustic, sound-attenuating portions of these laminates with such rigid attachment elements, however, provide sound bridges which result in the direct transmission of vibrational energy, particularly sound energy, through the acoustic layer, thereby deleteriously affecting the sound- attenuating properties thereof. This vibrational energy typically manifests as noise, in particular, low- frequency noise.

The effects of these noise transmitting rigid attachment elements are particularly objectionable in multi-unit buildings, such as condominiums, apartment buildings, and the like. For example, if two units of the multi-unit building, such as a first dwelling area and a second dwelling area located immediately above the first dwel ling area, are separated by flooring assemblies attached to the building structure with sound-bridging mechanical attachment elements, vibrations generated in the second area are transmitted to the first area as noise or other sounds, thereby disturbing the enjoyment of the first area.

In applicant's copending application, Serial No. 14/093, 131, there is described thinner and more economical flooring assemblies comprising flooring elements configured to be joined together to form finished floors having acoustic, sound-attenuating properties which are capable of being attached to building stmctures such as subfloor substrates in a one-step installation process without, creating vibrational energy transmitting sound-bridges through the acoustic portions thereof, even where the flooring assemblies are mechanically attached to structures.

It is an object of the present invention to provide alternative flooring assemblies which are even thinner and. less expensive than those described, in the copending application and yet provide essentially the same advantages thereo

SUMMARY OF THE INVENTION

The above and other objects are realized by the present invention, one embodiment of which relates to a flooring assembly comprising a plurality of flooring units, each unit comprising:

a stability core layer having a top surface, a bottom surface and a plurality of edge surfaces, at least two of the edge surfaces having an interlocking mechanism for attachment to the edge surfaces of the stability core of adjacent flooring units;

a sound attenuating acoustic layer attached to the bottom surface of the stability core layer; and

a finish layer attached to the top surface of the stability core layer, wherein:

(1) each of said stability core layer and said sound attenuating acoustic layer are polygonal,

(2) said assembly is attachable to a surface of a structure, and

(3) none of the edges of said sound attenuating acoustic layer have an interlocking mechanism for attachment to an edge of an adjacent sound attenuating acoustic layer.

The flooring assembly of the invention is constructed as to be easily attachable to a surface of a building structure

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 is a side eievational view of the flooring unit of the invention.

Figure 2 is a top eievational vie of the flooring unit of the invention. DETAILED DESCRIPTION OF THE INVENTION

The invention is predicated on the discovery that flooring assemblies constructed from flooring units as described above effectively isolate any rigid mechanical connecting elements from the finish floor layer thereby avoiding any direct transmission of sound energy between the finish layer and the building structure.

Embodiments of the present disclosure will be described with reference to the drawings. While various exemplary and preferred embodiments will be described, the disclosure is not limited thereto. On the contrary, various modifications and similar arrangements (as would be apparent to those skilled in the art) are intended to also be covered. Therefore, the scope of the appended claims should be accorded the broadest possible interpretation so as to encompass all such modifications and similar arrangements.

Referring to FIGS. Ϊ and 2, a flooring unit 10 is shown. The unit 10 includes a first polygonal stability core layer 2 having an interlocking mechanism : tongue x and groove y construction along at least two, preferably opposed, lateral edges for attachment to the edge surfaces of the stability core layer of an adjacent flooring unit. To the bottom surface of the stability core layer 2 is attached a sound attenuating acoustic layer 4. On the top surface of the stability core layer 2 i s attached a finish layer I ,

Between the acoustic layer 4 and core layer 2, an optional filler layer 3 (further described below) may be interposed. To the bottom surface of the acoustic layer 4, an optional backing layer 5 (further described below) may be attached. The filler and backing layers are employed in order to manage the thickness of the assembly and maintain material balance, where required.

Each of layers 1-3 and 5 are preferably identically polygonal in shape that may take any form, such as, for example, rectangular (boards, sheets, and the like) or square (tiles and the like). Each of the above described layers may be attached to each other by any suitable means; most preferably, adhesively.

The assembly of flooring units of the invention is attachable to a surface of a building structure; e.g., a sub-flooring surface by (1) an adhesive, (2) a mechanical connector, or (3) a combination of (1) and (2).

Thus, a primary advantage of the flooring units of the invention is that they may be assembled and attached to a building structure, such as, for example, a sub-floor to achieve an acoustic floor having no peneirating mechanical connections or rigid penetrations [such as nails] through the "acoustic layer" which would allow sound to bridge the layer; thereby denigrating the sound attenuating properties thereof, and achieving, at the same time, a durable connection between the building stmcture and the acoustic floor assembly. This is enabled by the unique construction of the flooring units which allows the mechanical connection to occur anywhere in the lower portion of the acou tic layer 4 or the backing layer 5. Referring to Figs. I and 2, the preferred mechanical connection locations are in the lower portion A of the acoustic layer 4 so that it may be covered by an overlapping acoustic layer from the adjoining piece of flooring or in the backing layer 5, avoiding altogether any acoustic penetrations through the acoustic layer that may bridge any sound from the top finish surface 1 to the building structure. The mechanical connector may take any suitable form, such as, for example, nail, screw, staple, bolt, clip, snap, and the like.

The construction and attachment of conventional prior art acoustic flooring requires the following steps:

(1) An acoustic layer having the required sound-attenuating value is installed on a subfioor.

(2) Two staggered layers of plywood are attached to the top surface of the acoustic laver adding 1-1/2" of thickness,

(3) A finish flooring layer (if wood, 3/4" thickness) is attached by nailing through the intervening staggered layers of plywood and the acoustic layer to the subfioor, thereby creating the undesirable sound-bridges between the finish layer and the subfioor.

Advantageously, the flooring assembly of the invention is constructed and attached to a subfioor as follows:

The assembly as described above, 3/4" ÷ acoustic layer, saving 1 1 /2" over conventional installation. The assembly of the invention is also advantageous over the assembly described in the above identified patent application in that it is considerably thinner and less expensive to construct

The assembly of the invention eliminates two of the steps required for the installation of prior art flooring assemblies and results in as much as I 1/2" thickness saving in overall thickness. Moreover, the flooring assembly of the invention enables the installation of floors in a one-step process which meet or surpass building sound code requirements [STC and IIC ratings] in most major cities in the world.

The flooring assembly is applicable for the installation of any suitable flooring finish. For example, the finish layer 1 may comprise any suitable material such as, for example, stone, wood, ceramic, metal, fabric, carpet, resin, rubber, polymer, or bamboo. Similarly, the optional filler layer 3 may also be constructed of these same finish or other suitable materials.

The acoustic layer 4 may comprise any suitable sound-attenuating construction material, such as, for example, rubber, polymeric or resinous material.

The stability core layer 2 may also comprise any suitable construction material which will provide structural stability to the flooring unit. Exemplary of such materials are wood, rubber, polymeric or resinous material, or a fiber matrix material.

The filler layer 3 and the backing layer 5 each may be constructed from stone, wood, ceramic, metal, fabric, carpet, resinous, rubber, polymeric, or bamboo material

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. The exemplary embodiments should be considered in descriptive sense only and not for purposes of limitation. Therefore, the scope of the invention is defined not by the detailed description of the invention but by the appended claims, and all differences within the scope will be construed as being included in the present invention.