ACOUSTIC SENSOR AND METHOD FOR MANUFACTURING SAME

Title:

ACOUSTIC SENSOR AND METHOD FOR MANUFACTURING SAME

Document Type and Number:

WIPO Patent Application WO/2013/031811

Kind Code:

A1

Abstract:

A cavity (44) is provided in a substrate (42) so as to penetrate from the front surface to the back surface of the substrate. A thin-film diaphragm (43) for sensing acoustic vibration above the substrate (42) is provided over the cavity (44). At least one wall surface of the cavity (44) is configured with: a first inclined surface (47a) between the front surface of the substrate (42) and the center portion of the substrate in the thickness direction, the inclined surface gradually widening toward the outer side of the substrate (42) from the front surface of the substrate (42) toward the center portion; and a second inclined surface (47b) between the center portion and the back surface of the substrate (42), the inclined surface gradually narrowing toward the inner side of the substrate (42) from the center portion toward the back surface of the substrate (42). Furthermore, the width of the back-surface opening of the cavity (44) is smaller than the width of the front-surface opening.

Inventors:

NAKAGAWA YUSUKE (JP)
TATARA YOSHITAKA (JP)
IIDA NOBUYUKI (JP)
ISHIMOTO KOICHI (JP)
HAMAGUCHI TSUYOSHI (JP)
KANO HAJIME (JP)

Application Number:

PCT/JP2012/071800

Publication Date:

March 07, 2013

Filing Date:

August 29, 2012

Export Citation:

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Assignee:

OMRON TATEISI ELECTRONICS CO (JP)
NAKAGAWA YUSUKE (JP)
TATARA YOSHITAKA (JP)
IIDA NOBUYUKI (JP)
ISHIMOTO KOICHI (JP)
HAMAGUCHI TSUYOSHI (JP)
KANO HAJIME (JP)

International Classes:

H04R19/04; H01L29/84; H04R31/00

Foreign References:

JP2008271568A	2008-11-06
JP4273438B2	2009-06-03
US7514287B2	2009-04-07
JP4539450B2	2010-09-08
JP2007295487A	2007-11-08

Other References: