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Title:
ACOUSTIC SURFACE WAVE COMPONENT
Document Type and Number:
WIPO Patent Application WO2003085827
Kind Code:
A3
Abstract:
The invention relates to an acoustic surface wave component, in which interdigital converter structures and reflector structures made of an electrically conductive material are arranged on a piezoelectric substrate. The aim of the invention is to provide measures for a surface wave component of this type with which the acoustomigration is significantly reduced, it is possible to shift frequencies to higher values, and inexpensive, pyroelectric substrates can be used without substantially impairing the transmission properties and the important temperature coefficients. The inventive acoustic surface wave component is characterized in that a 1 nm to 20 nm-thick layer, which is made of a diamond-like carbon having an sp3 proportion of > 30 % or made of another material having a modulus of elasticity of at least 200 GPa, is provided on and/or underneath the interdigital converter structures and reflector structures. Said layer is produced using a pulsed high-current arc method or another layer deposition method in order to create diamond-like carbon layers having a comparable sp3 proportion or to create other layers having moduli of elasticity in the area of at least 200 GPa.

Inventors:
KUNZE REINHARD (DE)
SIEMROTH PETER (DE)
WEIHNACHT MANFRED (DE)
WEIHNACHT VOLKER (DE)
SCHMIDT HAGEN (DE)
Application Number:
PCT/DE2003/001172
Publication Date:
November 27, 2003
Filing Date:
April 07, 2003
Export Citation:
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Assignee:
TELE FILTER ZWEIGNIEDERLASSUNG (DE)
FRAUNHOFER GES FORSCHUNG (DE)
KUNZE REINHARD (DE)
SIEMROTH PETER (DE)
WEIHNACHT MANFRED (DE)
WEIHNACHT VOLKER (DE)
SCHMIDT HAGEN (DE)
International Classes:
H03H9/02; (IPC1-7): H03H9/02
Foreign References:
DE19758195A11999-07-15
Other References:
SHIKATA S ET AL: "SAW device application of diamond", ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM, 1995, PROCEEDINGS OF 1995 JAPAN INTERNATIONAL, 18TH IEEE/CPMT INTERNATIONAL OMIYA, JAPAN 4-6 DEC. 1995, NEW YORK, NY, USA,IEEE, US, 4 December 1995 (1995-12-04), pages 379 - 382, XP010195622, ISBN: 0-7803-3622-4
SHIKATA S ET AL: "1.5 GHz SAW bandpass filter using poly-crystalline diamond", ULTRASONICS SYMPOSIUM, 1993. PROCEEDINGS., IEEE 1993 BALTIMORE, MD, USA 31 OCT.-3 NOV. 1993, NEW YORK, NY, USA,IEEE, 31 October 1993 (1993-10-31), pages 277 - 280, XP010115032, ISBN: 0-7803-1278-3
HICKERNELL T S ET AL: "The elastic properties of thin-film silicon nitride", PROCEEDINGS OF THE IEEE 1990 ULTRASONICS SYMPOSIUM;HONOLULU, HI, USA DEC 4-7 1990, vol. 1, 1990, Ultrason Symp Proc;Ultrasonics Symposium Proceedings 1990 Publ by IEEE, Piscataway, NJ, USA, pages 445 - 448, XP002255231
HICKERNELL F S ET AL: "The acoustic properties of PECVD thin-film silicon carbide", ULTRASONICS SYMPOSIUM, 1993. PROCEEDINGS., IEEE 1993 BALTIMORE, MD, USA 31 OCT.-3 NOV. 1993, NEW YORK, NY, USA,IEEE, 31 October 1993 (1993-10-31), pages 273 - 275, XP010115033, ISBN: 0-7803-1278-3
HICKERNELL F S ET AL: "Surface acoustic wave propagation on piezoelectric substrates with thin-film PECVD silicon nitride", FREQUENCY CONTROL SYMPOSIUM, 1995. 49TH., PROCEEDINGS OF THE 1995 IEEE INTERNATIONAL SAN FRANCISCO, CA, USA 31 MAY-2 JUNE 1995, NEW YORK, NY, USA,IEEE, US, 31 May 1995 (1995-05-31), pages 530 - 536, XP010155214, ISBN: 0-7803-2500-1
PASTORELLI R ET AL: "Elastic constants of ultrathin diamond-like carbon films", DIAMOND AND RELATED MATERIALS, ELSEVIER SCIENCE PUBLISHERS, AMSTERDAM, NL, vol. 9, no. 3-6, April 2000 (2000-04-01), pages 825 - 830, XP004199872, ISSN: 0925-9635
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