Title:
ACOUSTIC WAVE DEVICE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/054364
Kind Code:
A1
Abstract:
According to the present invention, a SAW device comprises: a mounting substrate which has a mounting surface; a SAW chip which is mounted on the mounting surface; a dummy chip which is mounted on the mounting surface; and a resin part which covers the SAW chip and the dummy chip. The dummy chip comprises: an insulating dummy substrate; and one or more dummy terminals which are disposed on the mounting surface-side surface of the dummy substrate, and which are bonded to the mounting surface. The dummy chip constitutes an electrically open end when viewed from the mounting substrate side.
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Inventors:
ITO MOTOKI (JP)
Application Number:
PCT/JP2018/033613
Publication Date:
March 21, 2019
Filing Date:
September 11, 2018
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H03H9/25; H01L23/29; H01L23/31; H01L25/00; H01L25/04; H01L25/18; H03H9/64; H03H9/72
Domestic Patent References:
| WO2013146374A1 | 2013-10-03 |
Foreign References:
| JP2017098300A | 2017-06-01 | |||
| JP2013110299A | 2013-06-06 |
Attorney, Agent or Firm:
IIJIMA, YASUHIRO (JP)
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