Title:
ACOUSTIC WAVE DEVICE, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/110057
Kind Code:
A1
Abstract:
Provided is an acoustic wave device in which stress acting on a piezoelectric body such as a piezoelectric substrate can be dispersed and the piezoelectric body is less likely to become damaged. The acoustic wave device 1 comprises a piezoelectric substrate 2 (piezoelectric body), an IDT electrode 3 (functional electrode) provided on the piezoelectric substrate 2, a support member 4 provided on the piezoelectric substrate 2 so as to surround the IDT electrode 3, and a cover member 6 provided on the support member 4. The support member 4 has a thermal expansion coefficient larger than that of the piezoelectric substrate 2. The IDT electrode 3 is provided in a hollow space A surrounded by the piezoelectric substrate 2, the support member 4, and the cover member 6. The support member 4 has: an inner surface 4b, which is the surface on the side of the hollow space A; and an outer surface 4c, which is the surface on the opposite side from the inner surface 4b. The support member 4 also has a recess 5 provided to the inner surface 4b and/or the outer surface 4c.
Inventors:
HATSUDA IPPEI (JP)
Application Number:
PCT/JP2017/036861
Publication Date:
June 21, 2018
Filing Date:
October 11, 2017
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H01L23/02; H01L23/10
Domestic Patent References:
| WO2009096563A1 | 2009-08-06 | |||
| WO2016199480A1 | 2016-12-15 |
Foreign References:
| JP2011199823A | 2011-10-06 | |||
| JP2010157956A | 2010-07-15 | |||
| JP2014036091A | 2014-02-24 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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