Title:
ACOUSTIC WAVE DEVICE, HIGH FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/044203
Kind Code:
A1
Abstract:
Provided are: an acoustic wave device wherein a laminated film is not susceptible to breakage and chipping, and a supporting substrate and the laminated film are not susceptible to peeling from each other; a high frequency front-end circuit; and a communication device. An acoustic wave device 1 is provided with: a supporting substrate 2; a laminated film 3, which is provided on the supporting substrate 2, and which is provided further toward the inside than at least a part of an outer end of the supporting substrate 2 in a plan view, said laminated film including a piezoelectric thin film 6; an IDT electrode 16 that is provided on the laminated film 3; an insulating layer 19, which is provided on the supporting substrate 2 and the laminated film 3, and which extends onto the laminated film 3 from the surface of the supporting substrate 2; a connecting electrode 17, which is provided on the insulating layer 19, and which is electrically connected to the IDT electrode 16; and an external connecting terminal, which is electrically connected to the connecting electrode 17, and which is directly or indirectly provided on the connecting electrode 17, and which is provided, in a plan view, outside of a region where the laminated film 3 is provided, said external connecting terminal being on the supporting substrate 2 in a plan view. A main surface of the supporting substrate 2, said main surface being on the laminated film 3 side, has, in a plan view, a recessed section 12 at the position of an outer end of the laminated film 3, and the recessed section 12 is covered with the insulating layer 19.
Inventors:
YAMAMOTO KOJI (JP)
NAKAGAWA MASATOSHI (JP)
NAKAGAWA MASATOSHI (JP)
Application Number:
PCT/JP2018/026354
Publication Date:
March 07, 2019
Filing Date:
July 12, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2015098678A1 | 2015-07-02 |
Foreign References:
| JP2017011681A | 2017-01-12 | |||
| JP2013223025A | 2013-10-28 | |||
| JP2007036656A | 2007-02-08 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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