Title:
ACOUSTIC WAVE DEVICE AND METHOD FOR MANUFACTURING ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/140362
Kind Code:
A1
Abstract:
This acoustic wave device comprises: a support substrate including a support member and an intermediate layer provided on the support member; a piezoelectric body layer provided on the intermediate layer; and a function electrode provided on the piezoelectric body layer. The piezoelectric body layer includes a through-hole penetrating through the piezoelectric body layer in a stacking direction of the support member, the intermediate layer, and the piezoelectric body layer. The support substrate includes a hollow portion provided in a position overlapping a part of the function electrode in the stacking direction, and a recess which is provided in a position of the hollow portion at least partly overlapping the through-hole in the stacking direction, and which is recessed in a direction away from the piezoelectric body layer.
Inventors:
YAMANE TAKASHI (JP)
INOUE KAZUNORI (JP)
NODAKE NAOHIRO (JP)
INOUE KAZUNORI (JP)
NODAKE NAOHIRO (JP)
Application Number:
PCT/JP2023/001755
Publication Date:
July 27, 2023
Filing Date:
January 20, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2016093020A1 | 2016-06-16 | |||
| WO2016068003A1 | 2016-05-06 |
Foreign References:
| US20210119595A1 | 2021-04-22 | |||
| JP2017224890A | 2017-12-21 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
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