Title:
ACOUSTIC WAVE DEVICE, ACOUSTIC WAVE DEVICE PACKAGE, HIGH-FREQUENCY FRONT-END CIRCUIT, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/164209
Kind Code:
A1
Abstract:
Provided is an acoustic wave device with which a first high-order mode response that propagates in a piezoelectric body can be suppressed. The acoustic wave device 1 comprises a support substrate 2 made of silicon on which a silicon oxide film 3, a piezoelectric body 4, and an IDT electrode 5 are stacked. When a wavelength determined by an electrode finger pitch of the IDT electrode 5 is λ, the support substrate 2 has a thickness of 3λ or more. The acoustic velocity of a first high-order mode that propagates in the piezoelectric body 4 is equal to or higher than acoustic velocity VSi
= (V1)1/2 of a bulk wave which propagates in the support substrate, the acoustic velocity being defined by V1 among the solution x = V1, V2, V3 derived from an expression (2).
(2) Ax3
+ Bx2
+ Cx + D = 0
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Inventors:
KOYANAGI TAKUYA (JP)
IWAMOTO HIDEKI (JP)
IWAMOTO HIDEKI (JP)
Application Number:
PCT/JP2018/008912
Publication Date:
September 13, 2018
Filing Date:
March 08, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/145; H03H9/25; H03H9/64
Domestic Patent References:
| WO2011046117A1 | 2011-04-21 | |||
| WO2013191122A1 | 2013-12-27 | |||
| WO2016208427A1 | 2016-12-29 | |||
| WO2017043394A1 | 2017-03-16 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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