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Patent Searching and Data


Title:
ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/092470
Kind Code:
A1
Abstract:
Provided is an acoustic wave device which can be downsized and suppress unnecessary waves. An acoustic wave device 1 is provided with: a piezoelectric substrate 2 made of LiNbO3; an IDT electrode 3 disposed on the piezoelectric substrate 2; and a first dielectric film 4 which is made of silicon oxide and disposed on the piezoelectric substrate 2 so as to cover the IDT electrode 3. The IDT electrode 3 has a first metal film made of at least one metal among Pt, Cu, Mo, Au, W and Ta, and the Euler angles (φ, θ, ψ) of the piezoelectric substrate 2 satisfy Euler angles (0°±5°, -90°≤θ≤-70°, 0°±5°). The metal and the film thickness hm/λ(%) of the first metal film satisfy any of the combinations shown in Table 1, where the wavelength defined by the electrode finger pitch of the IDT electrode 3 is λ, and the film thickness of the first metal film normalized by wavelength λ is hm/λ (%).

Inventors:
DAIMON KATSUYA (JP)
TAMAZAKI DAISUKE (JP)
Application Number:
PCT/JP2017/036681
Publication Date:
May 24, 2018
Filing Date:
October 10, 2017
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H03H9/145
Domestic Patent References:
WO2006114930A12006-11-02
WO2009090713A12009-07-23
Foreign References:
JP2013066250A2013-04-11
JP2014192676A2014-10-06
JP2010109417A2010-05-13
JP2008236588A2008-10-02
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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