Title:
ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/004205
Kind Code:
A1
Abstract:
Provided is an acoustic wave device with which the capacitance between a support substrate and a piezoelectric film can be suppressed and degradation of characteristics can be suppressed, and which, when connected to another electronic component, is not liable to cause an operating failure in the electronic component. An acoustic wave device 1 is provided with: a stacked body 8 which includes a support substrate 5 and a piezoelectric film 7 provided on the support substrate 5; an antenna terminal provided on the support substrate 5; a ground terminal 4A provided on the support substrate 5; a signal terminal 3 provided on the support substrate 5; an IDT electrode provided on the piezoelectric film 7; and a first insulating film 9A provided between the support substrate 5 and the signal terminal 3. The stacked body 8 includes one of a layer made of a high sonic speed material in which the sonic speed of a bulk wave propagating therein is higher than the sonic speed of an acoustic wave propagating in the piezoelectric film 7, or an acoustic reflection layer which includes a low acoustic impedance layer having a relatively low acoustic impedance and a high acoustic impedance layer having a relatively high acoustic impedance.
Inventors:
OKADA SHINICHI (JP)
Application Number:
PCT/JP2018/024180
Publication Date:
January 03, 2019
Filing Date:
June 26, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25
Domestic Patent References:
| WO2016208427A1 | 2016-12-29 | |||
| WO2016013330A1 | 2016-01-28 | |||
| WO2016208670A1 | 2016-12-29 | |||
| WO2013128823A1 | 2013-09-06 |
Foreign References:
| JP2016066989A | 2016-04-28 |
Attorney, Agent or Firm:
MIYAZAKI & METSUGI (JP)
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