Title:
ACOUSTIC WAVE DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/131014
Kind Code:
A1
Abstract:
According to the present invention, a support part (40) and a cover part (50) are provided with a through hole (80) that penetrates therethrough from the upper surface (51) of the cover part (50), said upper surface (51) being on the opposite side of the support part (40)-side surface, to the lower surface (41) of the support part (40), said lower surface (41) being on the substrate (10) side. The through hole (80) overlaps with a part of a wiring line (30) when viewed in plan. An acoustic wave device (100) according to the present invention additionally comprises: an electrode film (60) which is electrically connected to the wiring line (30) within the through hole (80); and a protective layer (70) which is formed from an insulating material, and which covers a part of the electrode film (60). The protective layer (70) is connected to the cover part (50) and the support part (40) within the through hole (80). The difference between the thermal expansion coefficient of the protective layer (70) and the thermal expansion coefficient of the cover part (50) and the support part (40) is smaller than the difference between the thermal expansion coefficient of the protective layer (70) and the thermal expansion coefficient of the electrode film (60).
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Inventors:
INOUE KAZUNORI (JP)
Application Number:
PCT/JP2018/044599
Publication Date:
July 04, 2019
Filing Date:
December 04, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H9/25; H01L23/04; H03H9/145
Domestic Patent References:
| WO2009057699A1 | 2009-05-07 |
Foreign References:
| JP2004248243A | 2004-09-02 | |||
| JP2014057124A | 2014-03-27 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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