Title:
ACOUSTIC WAVE GENERATING DEVICE AND METHOD FOR PRODUCING ACOUSTIC WAVE GENERATING DEVICE
Document Type and Number:
WIPO Patent Application WO/2013/089180
Kind Code:
A1
Abstract:
This acoustic wave generating device has: a thermally conductive substrate; a heat insulating layer formed on one principal surface of the substrate; and a heating element film formed over the heat insulating layer, and comprising an electrically conductive substrate electrically driven by the flow of an electrical current including an alternating current component. The heating element film comprises tungsten silicide. The heating element film is formed by sputtering of a mixture of tungsten and silicon, or of tungsten silicide, and has a crystal structure in which the tungsten atoms are bonded to one another by silicon atoms therebetween. The heat insulating layer comprises nanocrystal silicon. The thickness of the heating element film is 300 nm or less.
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Inventors:
YOSHIKADO SHINZO (JP)
YODA YUSUKE (JP)
INOUE MASAJI (JP)
MATSUMOTO TOSHIYUKI (JP)
YODA YUSUKE (JP)
INOUE MASAJI (JP)
MATSUMOTO TOSHIYUKI (JP)
Application Number:
PCT/JP2012/082325
Publication Date:
June 20, 2013
Filing Date:
December 13, 2012
Export Citation:
Assignee:
DOSHISHA (JP)
TOKYO ELECTRON LTD (JP)
TOKYO ELECTRON LTD (JP)
International Classes:
H04R23/00
Domestic Patent References:
| WO2006095709A1 | 2006-09-14 |
Foreign References:
| JP2009239518A | 2009-10-15 | |||
| JP2005073197A | 2005-03-17 | |||
| JP2008243460A | 2008-10-09 | |||
| JPS599887A | 1984-01-19 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
Tetsuo Kanamoto (JP)
Tetsuo Kanamoto (JP)
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Claims: