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Title:
ACOUSTIC WAVE PROBE COMPOSITION, ACOUSTIC WAVE PROBE SILICONE RESIN, ACOUSTIC WAVE PROBE, ULTRASONIC PROBE, ACOUSTIC WAVE MEASURING APPARATUS, ULTRASONIC DIAGNOSTIC APPARATUS, PHOTOACOUSTIC WAVE MEASURING APPARATUS, AND ULTRASONIC ENDOSCOPE
Document Type and Number:
WIPO Patent Application WO/2019/049984
Kind Code:
A1
Abstract:
Provided are: an acoustic wave probe composition containing components (A)-(D) below; and an acoustic wave probe silicone resin, an acoustic wave probe, an ultrasonic probe, an acoustic wave measuring apparatus, an ultrasonic diagnostic apparatus, a photoacoustic wave measuring apparatus, and an ultrasonic endoscope using the acoustic wave probe composition. (A) a linear polysiloxane having a vinyl group, (B) a linear polysiloxane having two or more Si-H groups in the molecular chain, (C) a polysiloxane resin, and (D) surface-treated silica particles having an average primary particle size of greater than 16 nm and less than 100 nm.

Inventors:
NAKAI YOSHIHIRO (JP)
UEHIRA SHIGEKI (JP)
KITAGAWA TAICHI (JP)
MATSUMOTO NOBUAKI (JP)
Application Number:
PCT/JP2018/033195
Publication Date:
March 14, 2019
Filing Date:
September 07, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
SHINETSU CHEMICAL CO (JP)
International Classes:
H04R17/00; A61B8/00; C08K9/06; C08L83/04; C08L83/05; C08L83/07
Domestic Patent References:
WO2017130890A12017-08-03
Foreign References:
JP2016108395A2016-06-20
JP2015189818A2015-11-02
JP2015189818A2015-11-02
JP2007099582A2007-04-19
JP2014114175A2014-06-26
JP2005253751A2005-09-22
JP2003169802A2003-06-17
JP2013202050A2013-10-07
JP2013188465A2013-09-26
JP2013180330A2013-09-12
JP2013158435A2013-08-19
JP2013154139A2013-08-15
JP2011071842A2011-04-07
JP2006157320A2006-06-15
JP2008311700A2008-12-25
JP2014080546A2014-05-08
JPH07331079A1995-12-19
JP2017174405A2017-09-28
Other References:
"Chemical Engineering Handbook", MARUZEN INC.
See also references of EP 3684078A4
Attorney, Agent or Firm:
IIDA & PARTNERS et al. (JP)
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