Title:
ACRYLIC DIELECTRIC ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2010/038574
Kind Code:
A1
Abstract:
A radical-polymerizable acrylic dielectric adhesive for NCF bonding of an electronic device to a wiring board, which comprises a (meth)acrylate monomer, a film-forming resin, an inorganic filler, a silane coupling agent, and a radical polymerization initiator. The content of the inorganic filler is 70 to 160parts by mass per 100 parts by mass of the sum total of the (meth)acrylate monomer and the film-forming resin. A radical-polymerized and cured product of the acrylic dielectric adhesive has a glass transition temperature of 150 to 185°C and exhibits a linear expansion coefficient (α1) of 30 to 35ppm in the temperature range below the glass transition temperature and a linear expansion coefficient (α2) of 105 to 125ppm in the temperature range not lower than the glass transition temperature. The (α2)/(α1) ratio is 3.4 or above.
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Inventors:
SATO DAISUKE (JP)
Application Number:
PCT/JP2009/065289
Publication Date:
April 08, 2010
Filing Date:
September 02, 2009
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
SATO DAISUKE (JP)
SATO DAISUKE (JP)
International Classes:
C09J4/02; C09J11/04; C09J11/06; C09J109/00; C09J171/12; H01L21/60
Domestic Patent References:
| WO2006098352A1 | 2006-09-21 | |||
| WO2001014484A1 | 2001-03-01 |
Foreign References:
| JP2002363218A | 2002-12-18 | |||
| JP2002167556A | 2002-06-11 | |||
| JP2005206717A | 2005-08-04 | |||
| JP2006127776A | 2006-05-18 | |||
| JP2001019821A | 2001-01-23 | |||
| JP2003253238A | 2003-09-10 | |||
| JP2003282637A | 2003-10-03 | |||
| JP2006274120A | 2006-10-12 | |||
| JPS6386539A | 1988-04-16 | |||
| JP2008150550A | 2008-07-03 | |||
| JP2007302881A | 2007-11-22 | |||
| JP2008231366A | 2008-10-02 |
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
Patent business corporation Tajime international patent firm (JP)
Patent business corporation Tajime international patent firm (JP)
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