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Patent Searching and Data


Title:
ACRYLIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/073364
Kind Code:
A1
Abstract:
[Problem] The present invention provides an acrylic resin composition which has low viscosity, which can be cured even by an LED irradiation device having low illuminance, and which provides a cured product that has adequate peel strength without addition of an additive for forced peeling, said cured product also having both toughness and bendability. [Solution] An acrylic resin composition which contains components (A)-(D) as essential ingredients, with component (B) being contained in an amount of 1,000-2,000 parts by mass, component (C) being contained in an amount of 30-250 parts by mass and component (D) being contained in an amount of 10-100 parts by mass, respectively per 100 parts by mass of component (A). Component (A): an acrylic oligomer Component (B): an acrylic monomer which contains components (b-1)-(b-3), respectively in an amount of at least 20% by mass of component (B) Component (b-1): an ether group-containing acrylic monomer and/or an ester group-containing acrylic monomer Component (b-2): a cyclic hydrocarbon group-containing acrylic monomer Component (b-3): an aromatic group-containing acrylic monomer Component (C): a thiol compound Component (D): a photoinitiator

Inventors:
NOGAMI YASUTOSHI (JP)
WACHI TAKANORI (JP)
Application Number:
PCT/JP2012/078032
Publication Date:
May 23, 2013
Filing Date:
October 30, 2012
Export Citation:
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Assignee:
THREE BOND CO LTD (JP)
International Classes:
C08G75/04; C09J4/02; C09J167/06; C09J175/14
Domestic Patent References:
WO2010071171A12010-06-24
WO2009011211A12009-01-22
Foreign References:
JP2004511578A2004-04-15
JPH03139525A1991-06-13
JP2011068727A2011-04-07
JP2010248455A2010-11-04
JP2010126569A2010-06-10
JP2012184323A2012-09-27
JP2005171168A2005-06-30
JP2006328094A2006-12-07
JPH02296350A1990-12-06
Other References:
See also references of EP 2781535A4
Attorney, Agent or Firm:
HATTA & ASSOCIATES (JP)
Hatta international patent business corporation (JP)
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Claims: