Title:
ACRYLIC RESIN POWDER, RESIN COMPOSITION, HOT-MELT ADHESIVE COMPOSITION INCLUDING ACRYLIC RESIN POWDER, AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/200558
Kind Code:
A1
Abstract:
The present invention relates to an acrylic resin powder which includes a multistage polymer (G) comprising an alkyl (meth)acrylate (ma) monomer unit and an alkyl (meth)acrylate (mb) monomer unit, the alkyl groups of the alkyl (meth)acrylates (ma) and (mb) each having 4-8 carbon atoms, wherein the multistage polymer (G) has a glass transition temperature of 50°C or higher, a mass-average molecular weight of 10,000-300,000, and a softening temperature, as determined by a flow tester temperature-rising method, of 150-200°C. The acrylic resin powder is soluble in acetone.
Inventors:
OKA KAZUYUKI (JP)
Application Number:
PCT/JP2021/012581
Publication Date:
October 07, 2021
Filing Date:
March 25, 2021
Export Citation:
Assignee:
MITSUBISHI CHEM CORP (JP)
International Classes:
C08F267/06; C08G18/42; C08G18/48; C08L51/06; C09J133/12; C09J175/06
Domestic Patent References:
WO2019188930A1 | 2019-10-03 | |||
WO2013061790A1 | 2013-05-02 | |||
WO2018012234A1 | 2018-01-18 | |||
WO2019188930A1 | 2019-10-03 |
Foreign References:
JPH06145262A | 1994-05-24 | |||
US4287106A | 1981-09-01 | |||
JP2019073668A | 2019-05-16 | |||
JP2013163821A | 2013-08-22 | |||
JP2020061289A | 2020-04-16 |
Other References:
POLYMER ENGINEERING AND SCIENCE, vol. 14, 1974, pages 147
See also references of EP 4130070A4
See also references of EP 4130070A4
Attorney, Agent or Firm:
TAZAKI Akira et al. (JP)
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