ACTINIC LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Title:

ACTINIC LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD

Document Type and Number:

WIPO Patent Application WO/2020/158337

Kind Code:

A1

Abstract:

The present invention provides an actinic light-sensitive or radiation-sensitive resin composition having excellent storage stability during long-term storage. Also provided are a resist film, a pattern formation method, and an electronic device manufacturing method relating to the actinic light-sensitive or radiation-sensitive resin composition. The actinic light-sensitive or radiation-sensitive resin composition of the present invention includes a compound represented by general formula (I) and an acid-degradable resin. M1 +A--L-B-M2 + (I)

Inventors:

UEMURA MINORU (JP)
KOJIMA MASAFUMI (JP)
GOTO AKIYOSHI (JP)
YAMAMOTO KEI (JP)
KAWASHIMA TAKASHI (JP)

Application Number:

PCT/JP2020/000544

Publication Date:

August 06, 2020

Filing Date:

January 10, 2020

Export Citation:

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Assignee:

FUJIFILM CORP (JP)

International Classes:

C09K3/00; G03F7/004; G03F7/038; G03F7/039; G03F7/20

Foreign References:

JP2011053364A	2011-03-17
JP2014149409A	2014-08-21
JP2011502276A	2011-01-20
JP2017102267A	2017-06-08
JP2006099024A	2006-04-13
JP2007507580A	2007-03-29