Title:
ACTINIC-LIGHT-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-LIGHT-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERNING METHOD, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/195588
Kind Code:
A1
Abstract:
Provided are an actinic-light-sensitive or radiation-sensitive resin composition that has high resolution ability and is capable of preventing device contamination, as well as an actinic-light-sensitive or radiation-sensitive film, patterning method, and method for manufacturing an electronic device that use the same. The actinic-light-sensitive or radiation-sensitive resin composition contains a resin having a solubility that is altered with respect to a developer by the action of acid, a compound that generates acid when irradiated with actinic light or radiation, and an acid diffusion control agent, with the molecular weight of the acid diffusion control agent being 420 or greater, and the difference Ra between the Hansen solubility parameter of the acid diffusion control agent and the Hansen solubility parameter of air satisfies 15 ≤ Ra ≤ 45.
Inventors:
TAKAHASHI KOTARO (JP)
YONEKUTA YASUNORI (JP)
MIYOSHI TARO (JP)
YONEKUTA YASUNORI (JP)
MIYOSHI TARO (JP)
Application Number:
PCT/JP2020/008780
Publication Date:
October 01, 2020
Filing Date:
March 03, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07D235/12; C07D263/57; C07D277/66; C08K5/3447; C08L101/12; G03F7/004; G03F7/039; G03F7/20
Foreign References:
| JP2013228681A | 2013-11-07 | |||
| JP2011232657A | 2011-11-17 | |||
| JP2007240631A | 2007-09-20 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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