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Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, PATTERN-FORMING METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2016/006489
Kind Code:
A1
Abstract:
 Provided are an actinic ray-sensitive or radiation-sensitive resin composition having a large depth of focus and excellent line width roughness, a pattern-forming method using said composition, and an electronic device production method. The actinic ray-sensitive or radiation-sensitive resin composition comprises a resin (P) containing: a repeat unit (a) that comprises at least a specific repeat unit (a1) represented by general formula (1), and that has a group that is decomposed by the action of an acid to generate a polar group; a repeat unit (b1) that has at least a lactone structure, a sultone structure or a carbonate structure; a repeat unit (b2) that is different to the repeat unit (b1) and that has at least a lactone structure, a sultone structure or a carbonate structure. The Ohnishi parameter of the repeat unit (b1) is larger that the Ohnishi parameter of the repeat unit (b2), and the difference between both is at least 0.85.

Inventors:
GOTO AKIYOSHI (JP)
KOJIMA MASAFUMI (JP)
SHIRAKAWA MICHIHIRO (JP)
KATO KEITA (JP)
Application Number:
PCT/JP2015/068680
Publication Date:
January 14, 2016
Filing Date:
June 29, 2015
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/038; C08F220/18; G03F7/039
Domestic Patent References:
WO2013133230A12013-09-12
Foreign References:
JP2012220824A2012-11-12
JP2013235115A2013-11-21
JP2015096911A2015-05-21
JP2014170167A2014-09-18
JP2014142424A2014-08-07
JP2012137518A2012-07-19
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
Mochitoshi Watanabe (JP)
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