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Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD, AND PRODUCTION METHOD FOR ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/044259
Kind Code:
A1
Abstract:
Provided is an actinic ray-sensitive or radiation-sensitive resin composition which can form a pattern having excellent LER properties, and can inhibit pattern collapse. Also, provided are a resist film using the actinic ray-sensitive or radiation-sensitive resin composition, a pattern forming method, and a production method for an electronic device. This actinic ray-sensitive or radiation-sensitive resin composition contains a resin having a group represented by general formula (1), and a compound which generates an acid when being irradiated with an actinic ray or radiation.

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Inventors:
KANEKO AKIHIRO (JP)
ITO JUNICHI (JP)
KAWASHIMA TAKASHI (JP)
OGAWA MICHIHIRO (JP)
TSUCHIMURA TOMOTAKA (JP)
Application Number:
PCT/JP2018/027290
Publication Date:
March 07, 2019
Filing Date:
July 20, 2018
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F20/26; C08F212/14; G03F7/20
Domestic Patent References:
WO2016136481A12016-09-01
Foreign References:
JP2016095506A2016-05-26
JP2013137537A2013-07-11
JP2003252928A2003-09-10
JP2012008500A2012-01-12
US20050164119A12005-07-28
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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