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Title:
ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC-RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2019/167451
Kind Code:
A1
Abstract:
Provided are: an actinic-ray-sensitive or radiation-sensitive resin composition which, even when the exposure scan rate is ultra high (e.g., 700 mm/sec or higher), exhibits high immersion liquid follow-up performance for an exposure device, and can reduce both liquid immersion defects and development defects; and an actinic-ray-sensitive or radiation-sensitive film, a pattern formation method, and an electronic device production method using the same. This actinic-ray-sensitive or radiation-sensitive resin composition contains a resin (P) having a repeating unit represented by the general formula (1) and a resin (A) having a group that is decomposed and that increases the polarity due to an acid acting thereupon. In the general formula (1), Z represents a hydrogen atom, an alkyl group, an alkoxy group, a halogen atom, a group represented by R11OCH2-, or a group represented by R12OC(=O)CH2-. R11 and R12 independently represent a monovalent substituent. X represents an oxygen atom or a sulfur atom. L represents a single bond or an (m + 1)-valent linking group. R represents a specific group. m represents a positive integer. When m is 2 or more, the multiple Rs may be the same or different from one another. When L represents a single bond, m represents 1.

Inventors:
TAKADA AKIRA (JP)
YAMAGUCHI SHUHEI (JP)
NOZAKI ATSUYASU (JP)
Application Number:
PCT/JP2019/000914
Publication Date:
September 06, 2019
Filing Date:
January 15, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F20/22; G03F7/20
Foreign References:
JP2015055868A2015-03-23
JP2012177101A2012-09-13
JP2013040320A2013-02-28
JP2016047816A2016-04-07
JP2005036160A2005-02-10
JP2001154362A2001-06-08
JP2004102019A2004-04-02
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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