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Patent Searching and Data


Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMATION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/158417
Kind Code:
A1
Abstract:
Provided is an actinic ray-sensitive or radiation-sensitive resin composition capable of forming a pattern having excellent resolution and excellent LWR performance. Also provided are a resist film using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern formation method; and an electronic device manufacturing method using the pattern formation method. The actinic ray-sensitive or radiation-sensitive resin composition is an actinic ray-sensitive or radiation-sensitive resin composition containing a resin and a compound that generates acid upon irradiation by actinic rays or radiation, wherein the compound that has an A value determined by formula (1) of 0.130 or higher and generates acid upon irradiation by actinic rays or radiation includes one or more selected from the group consisting of compound (I)-compound (III).

Inventors:
KANEKO AKIHIRO (JP)
KOJIMA MASAFUMI (JP)
UEMURA MINORU (JP)
GOTO AKIYOSHI (JP)
SHIRAKAWA MICHIHIRO (JP)
Application Number:
PCT/JP2020/001293
Publication Date:
August 06, 2020
Filing Date:
January 16, 2020
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F20/10; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
WO2018193954A12018-10-25
WO2014002808A12014-01-03
Foreign References:
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Other References:
JOURNAL OF THE INTERNATIONAL SOCIETY FOR OPTICAL ENGINEERING (PROC. OF SPIE, vol. 6924, 2008, pages 692420
"Semiconductor Process Text Book", 2007, SEMI
"EUV Resist Curing Technique for LWR Reduction and Etch Selectivity Enhancement", PROC. OF SPIE, vol. 8328
ACS NANO, vol. 4, no. 8, pages 4815 - 4823
See also references of EP 3919528A4
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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