Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMATION METHOD, PHOTOMASK, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2021/200178
Kind Code:
A1
Abstract:
The present invention provides: an actinic ray-sensitive or radiation-sensitive resin composition containing (A) a resin in which polarity is increased due to acid activity, and (B) a compound which is represented by a specific general formula and produces an acid due to irradiation with actinic rays or radiation; an actinic ray-sensitive or radiation-sensitive film formed by using the actinic ray-sensitive or radiation-sensitive resin composition; a pattern formation method; a photomask; and an electronic device manufacturing method; and a compound.
Inventors:
FUKUZAKI EIJI (JP)
MIYOSHI TARO (JP)
MIYOSHI TARO (JP)
Application Number:
PCT/JP2021/010954
Publication Date:
October 07, 2021
Filing Date:
March 17, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07C309/58; C07C311/29; C07C311/51; C07D275/06; C07D307/00; C07D307/82; C07D309/12; C07D333/34; C07D333/38; C09K3/00; G03F7/004; G03F7/039; G03F7/20
Foreign References:
| JP2002268217A | 2002-09-18 | |||
| JP2009209248A | 2009-09-17 | |||
| JP2019112394A | 2019-07-11 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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