Title:
ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE RESIN COMPOSITION, ACTINIC RAY-SENSITIVE OR RADIATION-SENSITIVE FILM, PATTERN FORMING METHOD AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/008127
Kind Code:
A1
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition is provided which has excellent storage stability and which enables excellent pattern shapes to be obtained when forming fine patterns (specifically, with a line width or space width less than or equal to 50 nm). This actinic ray-sensitive or radiation-sensitive film is an actinic ray-sensitive or radiation-sensitive resin composition that contains a compound (I) that generates an acid when irradiated by actinic rays or radiation, wherein the aforementioned compound (I) has two or more acid anionic groups and the same number of cationic groups, wherein at least one among the aforementioned acid anionic groups and at least one among the aforementioned cationic groups are linked by a covalent bond, and two or more acid groups generated by the aforementioned compound (I) by irradiation of the actinic rays or radiation include at least two acid groups with different acid dissociation constants (pKa).
Inventors:
KAWABATA TAKESHI (JP)
UEMURA MINORU (JP)
TSUCHIMURA TOMOTAKA (JP)
UEMURA MINORU (JP)
TSUCHIMURA TOMOTAKA (JP)
Application Number:
PCT/JP2022/026923
Publication Date:
February 02, 2023
Filing Date:
July 07, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C07D327/06; C07D295/26; C09K3/00; G03F7/004; G03F7/038; G03F7/039; G03F7/20
Domestic Patent References:
| WO2019130866A1 | 2019-07-04 |
Foreign References:
| JP2003267968A | 2003-09-25 | |||
| JP2019202991A | 2019-11-28 | |||
| JP2003005355A | 2003-01-08 | |||
| JP2013167825A | 2013-08-29 |
Attorney, Agent or Firm:
YONEKURA Junzo et al. (JP)
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