Title:
ACTINIC RAY SENSITIVE OR RADIATION SENSITIVE RESIN COMPOSITION, ACTINIC RAY SENSITIVE OR RADIATION SENSITIVE FILM, PATTERN FORMING METHOD, ELECTRONIC DEVICE MANUFACTURING METHOD, AND COMPOUND
Document Type and Number:
WIPO Patent Application WO/2023/032797
Kind Code:
A1
Abstract:
The present invention provides: an actinic ray sensitive or radiation sensitive resin composition containing a resin that undergoes decomposition through the action of an acid and gains a larger polarity, and a compound represented by a specific general formula (Q); and an actinic ray sensitive or radiation sensitive film, a pattern forming method, an electronic device manufacturing method, and a compound, all of which use the composition.
Inventors:
YOSHIOKA TOMOAKI (JP)
MIYOSHI TARO (JP)
MIYOSHI TARO (JP)
Application Number:
PCT/JP2022/031964
Publication Date:
March 09, 2023
Filing Date:
August 24, 2022
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; C07D309/38; C07D311/12; C07D311/14; C07D311/16; C07D311/18; C07D311/22; C07D311/24; G03F7/039
Foreign References:
| JPH09244235A | 1997-09-19 | |||
| JP2013092598A | 2013-05-16 | |||
| JP2015013997A | 2015-01-22 | |||
| JP2001343742A | 2001-12-14 |
Attorney, Agent or Firm:
KOH-EI PATENT FIRM, P.C. (JP)
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