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Title:
ACTIVE-ENERGY-CURABLE RESIN COMPOSITION, MOLDING, MICRORELIEF STRUCTURE, WATER-REPELLENT ARTICLE, MOLD, AND METHOD FOR PRODUCING MICRORELIEF STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2012/141238
Kind Code:
A1
Abstract:
An active-energy-curable resin composition which comprises (A) an alkyl (meth)acrylate that has an alkyl group having 12 or more carbon atoms in an amount of 3-18 parts by mass, and (B) a polyfunctional monomer having an sp value as expressed by a Fedor's estimation method of 20-23 and also having 3 or more radically polymerizable functional groups in the molecule in an amount of 82-97 parts by mass, both relative to 100 parts by mass of the total content of all of the monomers, and which enables the production of a cured article having excellent water repellency and scratch resistance; a molding, a microrelief structure and a water-repellent article, each of which is produced using the active-energy-curable resin composition; and a method for producing a microrelief structure.

Inventors:
TAKIHARA TSUYOSHI (JP)
OKAMOTO EIKO (JP)
Application Number:
PCT/JP2012/059989
Publication Date:
October 18, 2012
Filing Date:
April 12, 2012
Export Citation:
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Assignee:
MITSUBISHI RAYON CO (JP)
TAKIHARA TSUYOSHI (JP)
OKAMOTO EIKO (JP)
International Classes:
C08F2/48; G02B1/11; H01L21/027
Foreign References:
JP2010077282A2010-04-08
JP2012133079A2012-07-12
JP2010026309A2010-02-04
JPH09255866A1997-09-30
JP2009287017A2009-12-10
JP2007231233A2007-09-13
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
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Claims: