Title:
ACTIVE ENERGY RAY-CURABLE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/188625
Kind Code:
A1
Abstract:
The present invention addresses the problem of achieving: a low-cost (economically advantageous) active energy ray-curable adhesive composition which exhibits excellent adhesiveness without requiring aging after bonding, while additionally having easy availability, carbon-neutral advantages and high productivity during bonding steps; a method for producing a multilayer body with use of this active energy ray-curable adhesive composition; and a multilayer body which is achieved using this active energy ray-curable adhesive composition. The present invention provides, as a means for solving the problem, an active energy ray-curable adhesive composition which contains 45.0% by mass or more of a hydroxyl group-containing (meth)acrylate in all polymerizable components.
Inventors:
OMI NAOKI (JP)
Application Number:
PCT/JP2022/047335
Publication Date:
October 05, 2023
Filing Date:
December 22, 2022
Export Citation:
Assignee:
SAKATA INX CORP (JP)
International Classes:
C09J4/02; B32B27/00
Domestic Patent References:
| WO2011049138A1 | 2011-04-28 |
Foreign References:
| JP2017197711A | 2017-11-02 | |||
| JP2018193459A | 2018-12-06 | |||
| JP2016138182A | 2016-08-04 | |||
| JP2014189620A | 2014-10-06 | |||
| JP2020106830A | 2020-07-09 | |||
| JP2020024356A | 2020-02-13 |
Attorney, Agent or Firm:
YAMADA, Yasuyuki et al. (JP)
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